Conductive pattern and method of making
First Claim
1. A method of forming an RFID device, the method comprising:
- forming a first conductive pattern;
coupling a chip to the first conductive pattern;
positioning a dielectric layer with openings therein over the first conductive pattern wherein the coupling occurs through the openings in the dielectric layer and adhesively attaching the first conductive pattern to the dielectric layer;
placing a second conductive pattern on the dielectric layer;
coupling the second conductive pattern to at least one of the first conductive pattern and the chip; and
wherein the forming the first conductive pattern includes electroplating the first conductive pattern to the dielectric substrate or foil; and
the adhesively attaching includes adhesively peeling the first conductive pattern from the conductive substrate or foil.
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Accused Products
Abstract
A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
107 Citations
16 Claims
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1. A method of forming an RFID device, the method comprising:
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forming a first conductive pattern; coupling a chip to the first conductive pattern; positioning a dielectric layer with openings therein over the first conductive pattern wherein the coupling occurs through the openings in the dielectric layer and adhesively attaching the first conductive pattern to the dielectric layer; placing a second conductive pattern on the dielectric layer; coupling the second conductive pattern to at least one of the first conductive pattern and the chip; and
wherein the forming the first conductive pattern includes electroplating the first conductive pattern to the dielectric substrate or foil; and
the adhesively attaching includes adhesively peeling the first conductive pattern from the conductive substrate or foil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of forming an RFID device, the method comprising:
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forming a first conductive pattern; coupling a chip to the first conductive pattern and a battery is operatively connected to the chip; positioning a dielectric layer with openings therein over the first conductive pattern wherein the coupling occurs through the openings in the dielectric layer; placing a second conductive pattern on the dielectric layer; and coupling the second conductive pattern to at least one of the first conductive pattern and the chip and wherein the battery is de-activated until the chip is coupled to the conductive pattern.
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Specification