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Conductive pattern and method of making

  • US 7,930,815 B2
  • Filed: 10/20/2006
  • Issued: 04/26/2011
  • Est. Priority Date: 04/11/2003
  • Status: Active Grant
First Claim
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1. A method of forming an RFID device, the method comprising:

  • forming a first conductive pattern;

    coupling a chip to the first conductive pattern;

    positioning a dielectric layer with openings therein over the first conductive pattern wherein the coupling occurs through the openings in the dielectric layer and adhesively attaching the first conductive pattern to the dielectric layer;

    placing a second conductive pattern on the dielectric layer;

    coupling the second conductive pattern to at least one of the first conductive pattern and the chip; and

    wherein the forming the first conductive pattern includes electroplating the first conductive pattern to the dielectric substrate or foil; and

    the adhesively attaching includes adhesively peeling the first conductive pattern from the conductive substrate or foil.

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