Wireless IC device

• US 7,931,206 B2
• Filed: 05/21/2009
• Issued: 04/26/2011
• Est. Priority Date: 05/10/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ikemoto, Nobuo, Dokai, Yuya, Kato, Noboru
• Primary Examiner(s): Paik; Steven S
• Assistant Examiner(s): ANDERSON JR, WILLIAM MICHAEL
• Application Number:
  US12/469,896
• Publication Number:
  US 20090224061A1
• Time in Patent Office: 705 Days
• Field of Search: 235/439, 235/441, 235/487, 235/492, 343/700.MS, 343/795, 257/689
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate, and a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate. A mounting electrode is provided on the feeding circuit substrate. The frequency of signals sent and received using the radiation plate substantially corresponds to the resonant frequency of the resonant circuit. The wireless IC chip is electromagnetically coupled to the mounting electrode.

Claims

1. A wireless IC device comprising:

a radiation plate;

a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate;

a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate; and

a dielectric body arranged along a periphery of the wireless IC chip and covering the wireless IC chip;

wherein

a mounting electrode is provided on the feeding circuit substrate; and

the wireless IC chip is electromagnetically coupled to the mounting electrode, and a frequency of signals sent and/or received using the radiation plate substantially corresponds to a resonant frequency of the resonant circuit.

2. The wireless IC device according to claim 1, wherein the resonant circuit further includes a matching circuit.

3. The wireless IC device according to claim 1, wherein the dielectric body is disposed between the feeding circuit substrate and the wireless IC chip.

4. The wireless IC device according to claim 3, wherein the dielectric body is disposed between the mounting electrode of the feeding circuit substrate and the connection electrode of the wireless IC chip.

5. The wireless IC device according to claim 1, wherein the feeding circuit substrate is arranged so that a surface on which the wireless IC chip is disposed faces the radiation plate, and the resonant circuit and the radiation plate are electromagnetically coupled to each other.

6. The wireless IC device according to claim 1, wherein a relative dielectric constant of the dielectric body is at least 300.

7. The wireless IC device according to claim 1, wherein an operating frequency of the wireless IC chip is at least 300 MHz.

8. A wireless IC device comprising:

a radiation plate;

a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate;

a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate; and

a dielectric body disposed between the feeding circuit substrate and the wireless IC chip;

wherein

a mounting electrode is provided on the feeding circuit substrate;

the wireless IC chip is electromagnetically coupled to the mounting electrode, and a frequency of signals sent and/or received using the radiation plate substantially corresponds to a resonant frequency of the resonant circuit; and

a relative dielectric constant of the dielectric body is at least 300.

9. The wireless IC device according to claim 8, wherein the resonant circuit further includes a matching circuit.

10. The wireless IC device according to claim 8, wherein the dielectric body is disposed between the mounting electrode of the feeding circuit substrate and the connection electrode of the wireless IC chip.

11. The wireless IC device according to claim 8, wherein the dielectric body is arranged along a periphery of the wireless IC chip, and the wireless IC chip is covered with the dielectric body.

12. The wireless IC device according to claim 8, wherein the feeding circuit substrate is arranged so that a surface on which the wireless IC chip is disposed faces the radiation plate, and the resonant circuit and the radiation plate are electromagnetically coupled to each other.

13. The wireless IC device according to claim 8, wherein an operating frequency of the wireless IC chip is at least 300 MHz.