Circuit board for inkjet head

• US 7,931,354 B2
• Filed: 06/22/2006
• Issued: 04/26/2011
• Est. Priority Date: 06/23/2005
• Status: Active Grant

• Current Assignee: Brother Kogyo Kabushiki Kaisha
• Original Assignee: Brother Kogyo Kabushiki Kaisha
• Inventors: Imai, Koji
• Primary Examiner(s): Meier; Stephen D
• Assistant Examiner(s): MARTINEZ, CARLOS A
• Application Number:
  US11/472,523
• Publication Number:
  US 20060290742A1
• Time in Patent Office: 1,769 Days
• Field of Search: 347/69, 347/50, 347/71, 228/180.21, 228/101, 228/180.5, 438/106, 438/200, 438/540, 257/737
• US Class Current: 347/50
• CPC Class Codes: B41J 2/14201 Structure of print heads with piezoelectric elements
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 2201/09436 Pads or lands on permanent coating which covers the other conductors
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product soldering lead-in-hole components H05K3/3447
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof
• CPC Class Codes: H05K 3/363 by soldering

Abstract

Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.

Claims

1. A circuit board comprising:

a plurality of electrode rows arranged on one surface of a board;

wirings formed on said one surface and connected to a plurality of electrodes, respectively, included in said electrode rows;

through-holes formed in the board, corresponding to said plurality of electrodes, respectively; and

electrode connection sections each comprising a metal layer formed on an electrode layer—

arranged between the metal layer and other surface of the board—

and on an inner surface of the through-hole to face and be connected to an external electrode group via an electrically conductive brazing filler metal deposited on the metal layer in the through-hole and on the metal layer on the electrode layer, said metal layer having an area larger than an area of said electrode and being connected to said electrode through said through-hole,

wherein the wiring connected to the electrode included in one of said electrode rows is formed to pass between the electrodes included in other electrode row in an arrangement direction of said electrode rows,

said through-hole has an area smaller than the area of said electrode, and

the electrode layer is made of the same material as a material forming the electrode.

2. The circuit board according to claim 1, wherein the electrodes included in adjacent electrode rows are arranged in a zigzag pattern by shifting their positions in a row direction from each other, and said electrode connection section has a shape elongated in the arrangement direction.

3. The circuit board according to claim 1, wherein the center positions of the through-holes are aligned with the center positions of the electrodes.

4. The circuit board according to claim 1, wherein an area of each of the through-holes on the other surface side of the board is larger than the area of each of the through-holes on the one surface side of the board, and is smaller than the area of each of the electrodes.

5. The circuit board according to claim 1, wherein the wirings have widths smaller than the electrodes.

6. An inkjet head comprising:

an actuator having an electrode group corresponding to each of a plurality of nozzle holes, for ejecting ink from each of the nozzle holes; and

a circuit board connected to said actuator, wherein said circuit board is the circuit board defined in claim 1, and each of said plurality of electrode connection sections is arranged to face said electrode group, and said electrode connection sections and the electrodes included in said electrode group are connected.

7. The inkjet head according to claim 6, wherein said electrode connection sections are connected to the electrodes via the electrically conductive brazing filler metals.

8. The circuit board according to claim 1, further comprising the electrically conductive brazing filler metal deposited on a first portion of the electrode connection sections, wherein the electrode connection sections are connected to the electrodes at a second portion of the electrode connection sections.

9. The circuit board according to claim 1, wherein said electrode connection section covers the inner surface of said through hole.