Power rectifiers and method of making same
First Claim
1. A method of manufacturing a semiconductor rectifier device, the method comprising:
- depositing an N-drift region on an N++ substrate;
implanting boron into the N-drift region to create a P-body layer;
forming a plurality of trenches within the P-body layer, the trenches forming a plurality of P-body regions;
forming a dielectric layer within each trench of the plurality of trenches;
depositing conductive gate material to fill a remaining volume within each trench of the plurality of trenches;
etching back the conductive gate material to form a planar surface above the plurality of P-body regions;
depositing a layer of titanium and a layer of titanium nitride on the planar surface;
annealing to create a layer of titanium silicide at an interface between the plurality of P-body regions and the titanium layer, and in accordance therewith, forming a δ
p++ layer.
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Accused Products
Abstract
In one embodiment the present invention includes a semiconductor rectifier device comprising a first, second, and third semiconductor regions and a gate. The first semiconductor region is of a first conductivity type. The second semiconductor region is adjacent to the first semiconductor region which has a second conductivity type. The third semiconductor region is adjacent to the second semiconductor region which has the second conductivity type. The gate is proximate to but insulated from the second semiconductor region and electrically coupled to the third semiconductor region. When the first semiconductor region is biased in a first direction, an inversion region forms in the second semiconductor region. The inversion region forms a forward-biased tunnel diode junction with the third semiconductor region. When the first semiconductor region is biased a second direction, the semiconductor rectifier device functions as a reverse-biased PIN diode.
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Citations
20 Claims
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1. A method of manufacturing a semiconductor rectifier device, the method comprising:
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depositing an N-drift region on an N++ substrate; implanting boron into the N-drift region to create a P-body layer; forming a plurality of trenches within the P-body layer, the trenches forming a plurality of P-body regions; forming a dielectric layer within each trench of the plurality of trenches; depositing conductive gate material to fill a remaining volume within each trench of the plurality of trenches; etching back the conductive gate material to form a planar surface above the plurality of P-body regions; depositing a layer of titanium and a layer of titanium nitride on the planar surface; annealing to create a layer of titanium silicide at an interface between the plurality of P-body regions and the titanium layer, and in accordance therewith, forming a δ
p++ layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor rectifier device comprising:
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an anode terminal; a δ
p++ layer electrically coupled to the anode terminal;a P-body region located adjacent to the δ
p++ layer;an N-drift region located adjacent to the P-body region; an N++ substrate located adjacent to the N-drift region; a cathode terminal electrically coupled to the N++ substrate; a dielectric layer perpendicular to the δ
p++ layer and adjacent to the P-body region; anda conductive layer adjacent and parallel to the dielectric layer, the conductive layer electrically coupled to the anode terminal, wherein if a forward bias of the semiconductor rectifier device is provided across the anode and cathode terminals, the P-body region inverts and becomes an n-type conductive channel, and in accordance therewith, an interface of a portion of the δ
p++ layer and the n-type conductive channel form a tunnel diode. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A semiconductor rectifier device comprising:
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an anode terminal; a δ
p++ layer electrically coupled to the anode terminal;a plurality of P-body regions each located adjacent to a portion of the δ
p++ layer;an N-drift region located adjacent to the plurality of P-body regions; a plurality of trenches having sides adjacent to the P-body regions and having a bottom protruding within the n-drift region, each trench comprising, a dielectric layer forming a first layer covering the sides and bottom of the trench, a conductive layer filling a remaining volume within the trench; an N++ substrate located adjacent to the N-drift region; a cathode terminal electrically coupled to the N++ substrate; wherein if a forward bias of the semiconductor rectifier device is provided across the anode and cathode terminals, each side of the P-body region of the plurality of P-body regions inverts and becomes an n-type conductive channel, and in accordance therewith, a plurality of interfaces between a plurality of portions of the δ
p++ layer and their corresponding n-type conductive channels form a plurality of tunnel diodes. - View Dependent Claims (18, 19, 20)
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Specification