Microfluidic chip apparatuses, systems and methods having fluidic and fiber optic interconnections

• US 7,933,012 B2
• Filed: 08/10/2006
• Issued: 04/26/2011
• Est. Priority Date: 08/11/2005
• Status: Expired due to Fees

• Current Assignee: AB Sciex LLC (Danaher Corporation)
• Original Assignee: AB Sciex LLC (Danaher Corporation)
• Inventors: Nevill, Joshua T., Pettigrew, Kenneth I., Crenshaw, Hugh C., Warrington, Brian Herbert, Hartmann, Daniel M., Kung, Pang-Jen Craig
• Primary Examiner(s): STAFIRA, MICHAEL PATRICK
• Application Number:
  US11/719,527
• Publication Number:
  US 20090147253A1
• Time in Patent Office: 1,720 Days
• Field of Search: 356244-246
• US Class Current: 356/246
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0654 Lenses; Optical fibres
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: G01N 2021/0346 Capillary cells; Microcells
• CPC Class Codes: G02B 6/10 of the optical waveguide type G02B6/02, G02B6/24 take precedence; devices or arrangements for the control of light by electric, magnetic, electro-magnetic or acoustic means G02F1/00; transferring the modulation of modulated light G02F2/00; optical logic elements G02F3/00; optical analogue/digital converters G02F7/00
• CPC Class Codes: G02B 6/1228 Tapered waveguides, e.g. integrated spot-size transformers for coupling with fibres G02B6/305
• CPC Class Codes: G02B 6/305 and having an integrated mode-size expanding section, e.g. tapered waveguide
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3644 the coupling means being through-holes or wall apertures
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3688 using laser ablation
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/3696 by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques shaping the mould surface by machining B29C33/38; moulding techniques B29C39/00, B29C43/00, B29C45/00, B29C48/00, B29C59/00; stamping, printing or embossing techniques B81C1/00444; surface micromachining using LIGA B81C2201/032
• CPC Class Codes: Y10T 29/49885 with coating before or during assembling

Abstract

According to one embodiment, apparatuses and methods are provided for connecting a light-guiding conduit to a microfluidic channel. First and second substrates with first surfaces can be provided, wherein the first surfaces of the first and second substrates form a microfluidic channel and a connection channel when the first surfaces are positioned together, and wherein the connection channel extends from an edge of the first surface of the first or second substrate to the microfluidic channel. The apparatus and method can also include bonding the first surfaces of the first and second substrates to form the microfluidic channel and the connection channel. A light-guiding conduit can be inserted into the connection channel such that the light-guiding conduit connects to the microfluidic channel and filling an area between the light-guiding conduit and the connection channel for forming a liquid-tight seal between the light-guiding conduit and the connection channel.

Claims

1. A method for connecting a light-guiding conduit to a microfluidic channel, the method comprising:

(a) providing a first and second substrate comprising first surfaces, wherein the first surfaces of the first and second substrates form a microfluidic channel and a connection channel when the first surfaces are positioned together, and wherein the connection channel extends from an edge of the first surface of the first or second substrate to the microfluidic channel;

(b) inserting a light-guiding conduit having an end into the connection channel such that the light-guiding conduit stops at a point where the end of the light-guiding conduit meets an edge of the connection channel;

(c) inserting a light-curable adhesive into an area between the light-guiding conduit and the connection channel, wherein the light-curable adhesive flows toward the end of the connection channel with a leading edge;

(d) delivering a light beam to light-curable adhesive through the end of the light-guiding conduit; and

(e) curing the leading edge of the light-curable adhesive.

2. The method of claim 1, wherein the first substrate comprises a material selected from the group consisting of polymer, metal, silicon, silica, glass, quartz, sapphire, zinc oxide, alumina, Group III-V compounds, and combinations thereof.

3. The method of claim 1, wherein the first surface of the first substrate is at least substantially planar.

4. The method of claim 1, wherein the second substrate comprises a material selected from the group consisting of polymer, metal, silicon, silica, glass, quartz, sapphire, zinc oxide, alumina, Group III-V compounds, and combinations thereof.

5. The method of claim 1, wherein the first surface of the second substrate is at least substantially planar, and the first surface of the first substrate comprises the microfluidic channel and connection channel formed therein.

6. The method of claim 1, wherein the microfluidic channel and the connection channel are in fluid communication.

7. The method of claim 1, wherein the step of providing a first and second substrate comprises forming the connection channel in the first surface of one of the first and second substrates.

8. The method of claim 7, further comprising forming the microfluidic channel in the first surface of one of the first and second substrates.

9. The method of claim 1, wherein the length of the connection channel is approximately 3 to 10 millimeters.

10. The method of claim 1, wherein the connection channel is at least substantially cylindrical in shape.

11. The method of claim 1, wherein the connection channel is at least substantially semi-cylindrical in shape.

12. The method of claim 1, wherein the step of bonding comprises thermal bonding.

13. The method of claim 1, wherein the step of inserting the light-guiding conduit into the connection channel occurs prior to the step of bonding the first surfaces of the first and second substrates.

14. The method of claim 1, wherein insertion of the light-guiding conduit is limited by a decreased diameter of the connection channel.

15. The method of claim 14, wherein the decreased diameter of the light-guiding conduit is a taper that transitions to the microfluidic channel.

16. The method of claim 1, wherein insertion of the light-guiding conduit is facilitated by an opening of the connection channel that is greater than the diameter of the connection channel.

17. The method of claim 16, wherein the larger diameter opening is a taper that transitions to the microfluidic channel.

18. The method of claim 1, wherein the step of inserting the light-guiding conduit comprises positioning an end of the light-guiding conduit in the connection channel, wherein the end of the connection channel is approximately 0 to 200 micrometers from the microfluidic channel.

19. The method of claim 1, wherein the maximum diameter of the light-guiding conduit is smaller than the minimum diameter of the connection channel.

20. The method of claim 1, wherein the maximum diameter of the light-guiding conduit is approximately the same as the minimum diameter of the connection channel.

21. The method of claim 1, wherein the light-guiding conduit is a capillary tube.

22. The method of claim 1, wherein the light-guiding conduit is a light-guiding capillary tube.

23. The method of claim 1, wherein the light-guiding conduit is a fiber optic.

24. The method of claim 1, wherein the method further comprises applying a second light beam to cure adhesive not cured by the first light beam.

25. The method of claim 24, wherein the light-guiding conduit is a light-guiding capillary, and the cured adhesive completes a fluid path from a lumen of the light-guiding capillary to the microfluidic channel.

26. The method of claim 1, wherein the step of delivering comprises positioning the area between the light-guiding conduit and the connection channel at an adhesive dispenser for receiving the adhesive substance.

27. The method of claim 1, further comprising providing a computer for controlling the positioning of the area between the light-guiding conduit and the connection channel at an adhesive dispenser.