Method and apparatus for using a database to quickly identify and correct a manufacturing problem area in a layout

• US 7,934,174 B2
• Filed: 07/27/2009
• Issued: 04/26/2011
• Est. Priority Date: 02/17/2006
• Status: Active Grant

• Current Assignee: Synopsys Incorporated
• Original Assignee: Synopsys Incorporated
• Inventors: Zhang, Daniel N., Kim, Juhwan, Tang, Zong Wu, Fang, Weiping, Song, Hua, Melvin, Lawrence S. III
• Primary Examiner(s): LEVIN, NAUM B
• Application Number:
  US12/509,854
• Publication Number:
  US 20090288047A1
• Time in Patent Office: 638 Days
• Field of Search: 716/52, 716/53, 716/136, 703/14
• US Class Current: 716/53
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/398 Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] optical proximity correction [OPC] design processes G03F1/36
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

One embodiment provides a system for using a database to quickly identify a manufacturing problem area in a layout. During operation, the system receives a first check-figure which identifies a first area in a first layout, wherein the first area is associated with a first feature. Next, the system determines a first sample using the first check-figure, wherein the first sample represents the first layout'"'"'s geometry within a first ambit of the first check-figure, wherein the first sample'"'"'s geometry is expected to affect the shape of the first feature. The system then performs a model-based simulation using the first sample to obtain a first simulation-result which indicates whether the first feature is expected to have manufacturing problems. Next, the system stores the first simulation-result in a database which is used to quickly determine whether a second feature is expected to have manufacturing problems.

Claims

1. A computer-implemented method to identify a manufacturing problem area in a layout, the method comprising:

performing, by computer, a model-based simulation for a first sample in the layout to obtain a first simulation-result which indicates whether a feature associated with the first sample in the layout is expected to have manufacturing problems;

associating, in a database, the first sample with the first simulation-result;

determining that a second sample in the layout, when oriented differently, is substantially similar to the first sample in the layout by;

performing an exclusive-OR operation between the first sample and the second sample in a different orientation to obtain an exclusive-OR result, and

determining whether the exclusive-OR result contains any polygons; and

in response to determining that the second sample in the layout, when oriented differently, is substantially similar to the first sample in the layout, using the first simulation-result to determine whether a feature associated with the second sample in the layout is expected to have manufacturing problems.

2. The method of claim 1, wherein performing the model-based simulation for the first sample includes convolving a process model with the first sample.

3. The method of claim 1, wherein associating the first sample with the first simulation-result includes:

determining a first hash value based at least on coordinates associated with one or more polygons in the first sample; and

associating the first hash value with the first simulation-result.

4. The method of claim 1, wherein prior to performing the model-based simulation for the first sample in the layout, the method comprises:

identifying a polygon'"'"'s edge in the layout which is susceptible to manufacturing problems; and

determining the first sample by determining an area in the layout within a first ambit of the polygon'"'"'s edge.

5. A computer-implemented method to perform proximity correction on a layout, the method comprising:

determining, by computer, a first proximity-correction which when applied to a first sample corrects a manufacturing problem in a feature associated with the first sample;

associating the first sample with the first proximity-correction in a database;

determining that a second sample in the layout, when oriented differently, is substantially similar to the first sample in the layout by;

performing an exclusive-OR operation between the first sample and the second sample in a different orientation to obtain an exclusive-OR result, and

determining whether the exclusive-OR result contains any polygons; and

in response to determining that the second sample in the layout, when oriented differently, is substantially similar to the first sample in the layout, applying the first proximity-correction to the second sample to correct a manufacturing problem in a feature associated with the second sample.

6. The method of claim 5, wherein associating the first sample with the first proximity-correction includes:

determining a first hash value based at least on coordinates associated with one or more polygons in the first sample; and

associating the first hash value with the first proximity-correction.

7. The method of claim 5, wherein the method comprises:

identifying a polygon'"'"'s edge in the layout which is susceptible to manufacturing problems; and

determining the first sample by determining an area in the layout within a first ambit of the polygon'"'"'s edge.

8. A computer-readable storage device storing instructions that when executed by a computer cause the computer to perform a method for proximity correction on a layout, the method comprising:

determining a first proximity-correction which when applied to a first sample corrects a manufacturing problem in a feature associated with the first sample;

associating the first sample with the first proximity-correction in a database;

determining that a second sample in the layout, when oriented differently, is substantially similar to the first sample in the layout by;

performing an exclusive-OR operation between the first sample and the second sample in a different orientation to obtain an exclusive-OR result, and

determining whether the exclusive-OR result contains any polygons; and

in response to determining that the second sample in the layout, when oriented differently, is substantially similar to the first sample in the layout, applying the first proximity-correction to the second sample to correct a manufacturing problem in a feature associated with the second sample.

9. The computer-readable storage device of claim 8, wherein associating the first sample with the first proximity-correction includes:

determining a first hash value based at least on coordinates associated with one or more polygons in the first sample; and

associating the first hash value with the first proximity-correction.

10. The computer-readable storage device of claim 8, wherein the method comprises:

identifying a polygon'"'"'s edge in the layout which is susceptible to manufacturing problems; and

determining the first sample by determining an area in the layout within a first ambit of the polygon'"'"'s edge.