Semiconductor light emitting device and method of manufacturing the same
First Claim
Patent Images
1. A method of manufacturing a semiconductor light emitting device having a nano pattern, the method comprising:
- (a) forming a first semiconductor layer on a substrate;
(b) forming etch pits in defect regions of the first semiconductor layer by wet-etching an upper surface of the first semiconductor;
(c) forming a nano pattern by filling the etch pits of the first semiconductor layer with light-transmissive material; and
sequentially forming a second semiconductor layer, an active layer, and a third semiconductor layer on the first semiconductor layer,wherein step (c) comprises;
coating a light-transmissive material over the first semiconductor layer to fill the etch pits; and
leveling the first semiconductor layer such that a surface of the first semiconductor layer is exposed and the exposed surface of the first semiconductor layer is coplanar with the filled light transmissive material.
2 Assignments
0 Petitions
Accused Products
Abstract
Provided are a semiconductor light emitting device having a nano pattern and a method of manufacturing the semiconductor light emitting device. The semiconductor light emitting device includes: a semiconductor layer comprising a plurality of nano patterns, wherein the plurality of nano patterns are formed inside the semiconductor layer; and an active layer formed on the semiconductor layer. The optical output efficiency is increased and inner defects of the semiconductor light emitting device are reduced.
-
Citations
5 Claims
-
1. A method of manufacturing a semiconductor light emitting device having a nano pattern, the method comprising:
-
(a) forming a first semiconductor layer on a substrate; (b) forming etch pits in defect regions of the first semiconductor layer by wet-etching an upper surface of the first semiconductor; (c) forming a nano pattern by filling the etch pits of the first semiconductor layer with light-transmissive material; and sequentially forming a second semiconductor layer, an active layer, and a third semiconductor layer on the first semiconductor layer, wherein step (c) comprises; coating a light-transmissive material over the first semiconductor layer to fill the etch pits; and leveling the first semiconductor layer such that a surface of the first semiconductor layer is exposed and the exposed surface of the first semiconductor layer is coplanar with the filled light transmissive material. - View Dependent Claims (2, 3, 4, 5)
-
Specification