Method and system for sealing a substrate
First Claim
1. An electronic device comprising a micro-electromechanical systems (MEMS) device, a metal layer, a mask, a metal seal layer, and a backplane prepared by a process comprising:
- providing a MEMS device on a substrate;
depositing a metal layer on the substrate;
forming a mask with one or more perimeter cavities over the metal layer;
depositing one or more metal seal layers in the one or more perimeter cavities, thereby forming a seal proximate to the perimeter cavities of the MEMS device; and
joining a backplane to the seal.
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Accused Products
Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
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Citations
15 Claims
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1. An electronic device comprising a micro-electromechanical systems (MEMS) device, a metal layer, a mask, a metal seal layer, and a backplane prepared by a process comprising:
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providing a MEMS device on a substrate; depositing a metal layer on the substrate; forming a mask with one or more perimeter cavities over the metal layer; depositing one or more metal seal layers in the one or more perimeter cavities, thereby forming a seal proximate to the perimeter cavities of the MEMS device; and joining a backplane to the seal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification