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Photosensor and photo IC equipped with same

  • US 7,935,934 B2
  • Filed: 12/26/2008
  • Issued: 05/03/2011
  • Est. Priority Date: 01/15/2008
  • Status: Active Grant
First Claim
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1. A photosensor comprising:

  • a silicon substrate;

    an insulating layer formed over the silicon substrate;

    an ultraviolet photosensitive element formed over the insulating layer and having a first diffusion layer having a first conductivity type, a second diffusion layer provided spaced away from the first diffusion layer and having a second conductivity type opposite to the first conductivity type, and a third diffusion layer connected with the first diffusion layer and the second diffusion layer respectively and having the first conductivity type; and

    a visible light photosensitive element formed over the insulating layer with being spaced away from the ultraviolet photosensitive element, said visible light photosensitive element having a fourth diffusion layer having a third conductivity type, a fifth diffusion layer provided spaced away from the fourth diffusion layer and having a fourth conductivity type opposite to the third conductivity type, and a sixth diffusion layer connected with the fourth diffusion layer and the fifth diffusion layer respectively and having the third conductivity type,wherein the thickness of the third diffusion layer of the ultraviolet photosensitive element is smaller than that of the sixth diffusion layer of the visible light photosensitive element.

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