Measuring in-situ UV intensity in UV cure tool
First Claim
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1. An ultraviolet (UV) apparatus for semiconductor processing, the apparatus comprising:
- (a) a process chamber comprising a substrate holder and a window; and
,(b) a UV radiation assembly external to the process chamber, the assembly comprisingi) at least two UV lamps,ii) one or more reflectors operable to direct a portion of the UV radiation from the at least two UV lamps through the window towards the substrate holder,iii) an in situ UV intensity detector disposed between the at least two UV lamps, andiv) a shutter or iris configured to isolate the UV intensity detector from the UV radiation between measurements; and
,(c) a controller configured to execute a set of instructions, the set of instructions comprising;
opening the shutter or iris to expose a UV detector to the UV radiation;
measuring a UV intensity at a UV radiation power with the UV detector;
after measuring, closing a shutter or iris to isolate the UV detector from the UV radiation;
calculating a deviation based on the measurement and a baseline intensity; and
,adjusting the UV radiation power or exposure duration to compensate for the deviation.
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Abstract
Consistent ultraviolet (UV) intensity for a semiconductor UV cure chamber is measured in-situ with a hot pedestal in vacuum by measuring reflected UV light from a calibration substrate at a UV detector mounted in the lamp assembly. The measurement apparatus includes a UV detector, a cover that protects the detector from UV light while not in use, and a mirror disposed between the chamber window and the UV detector. Measured UV intensity from the substrate reflection and from the mirror reflection help determine a course of maintenance action to maintain wafer-to-wafer uniformity.
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Citations
19 Claims
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1. An ultraviolet (UV) apparatus for semiconductor processing, the apparatus comprising:
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(a) a process chamber comprising a substrate holder and a window; and
,(b) a UV radiation assembly external to the process chamber, the assembly comprising i) at least two UV lamps, ii) one or more reflectors operable to direct a portion of the UV radiation from the at least two UV lamps through the window towards the substrate holder, iii) an in situ UV intensity detector disposed between the at least two UV lamps, and iv) a shutter or iris configured to isolate the UV intensity detector from the UV radiation between measurements; and
,(c) a controller configured to execute a set of instructions, the set of instructions comprising; opening the shutter or iris to expose a UV detector to the UV radiation; measuring a UV intensity at a UV radiation power with the UV detector; after measuring, closing a shutter or iris to isolate the UV detector from the UV radiation; calculating a deviation based on the measurement and a baseline intensity; and
,adjusting the UV radiation power or exposure duration to compensate for the deviation.
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2. An ultraviolet (UV) apparatus for semiconductor processing, the apparatus comprising:
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(a) a process chamber comprising a substrate holder and a window; and
,(b) a UV radiation assembly external to the process chamber, the assembly comprising i) at least two UV lamps, ii) one or more reflectors operable to direct a portion of the UV radiation from the at least two UV lamps through the window towards the substrate holder, iii) an UV intensity detector positioned between the at least two UV lamps to receive UV radiation from the at least two UV lamps reflected through the window, iv) a cover configured to isolate the UV detector from radiation from the at least two UV lamps. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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10. A method of calibrating an ultraviolet (UV) apparatus, the method comrising:
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(a) receiving a calibration indication or determining that a calibration is required; (b) setting a UV radiation power from at least two UV lamps to a first power; and
,(c) measuring an output over a duration of an in situ UV intensity detector disposed between the at least two UV lamps; wherein a chamber vacuum is maintained during the calibration and wherein the method further comprises opening a shutter to expose a UV detector to the UV radiation prior to (c); and
closing a shutter to isolate the UV detector from the UV radiation after (c). - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification