Wafer level chip packaging

• US 7,936,062 B2
• Filed: 01/19/2007
• Issued: 05/03/2011
• Est. Priority Date: 01/23/2006
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Tessera Technologies Ireland Limited (Adeia Inc.)
• Inventors: Reifel, Mitchell Hayes, Hecht, Ilya, Dayan, Avi, Hazanovich, Felix, Avsian, Osher, Aksenton, Yulia, Burtzlaff, Robert, Nystrom, Michael J., Grinman, Andrey, Rosenstein, Charles, Humpston, Giles, Ovrutsky, David, Oganesian, Vage
• Primary Examiner(s): Wilczewski; Mary
• Assistant Examiner(s): Green; Telly D
• Application Number:
  US11/655,777
• Publication Number:
  US 20070190691A1
• Time in Patent Office: 1,565 Days
• Field of Search: 257/680, 257/704, 257/711, 257/726, 257/729
• US Class Current: 257/704
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.

Claims

1. A packaged microelectronic element, comprising:

a microelectronic element having a front face and a plurality of peripheral edges bounding said front face, a device region at said front face and a contact region including a plurality of exposed contacts adjacent to at least one of said peripheral edges;

support walls overlying said front face;

a lid mounted to said support walls above said microelectronic element, said lid having an inner surface confronting said front face, wherein at least some of said contacts are exposed beyond edges of said lid; and

an adhesive which bonds the front face of the microelectronic element to at least a portion of the support walls which is remote from the lid;

wherein said support walls extend directly from the inner surface of the lid and consist essentially of a polymer;

wherein said microelectronic element includes an optoelectronic device in said device region, wherein said lid is at least partially transparent to energy at wavelengths of interest with respect to operation of said optoelectronic device.

2. The packaged microelectronic element as claimed in claim 1, wherein said support walls are bonded by an adhesive to at least one of said front face of said microelectronic element or said inner surface of said lid.

3. The packaged microelectronic element as claimed in claim 2, wherein edges of said support walls are exposed beyond said edges of said lid.

4. The packaged microelectronic element as claimed in claim 1, wherein said support walls include recesses, the recesses extending in at least a lateral direction transverse to a normal direction with respect to said front face.

5. The packaged microelectronic element as claimed in claim 1, wherein at least some of said edges of said lid are oriented at an angle with respect to a normal to said front face of the microelectronic element.

6. The packaged microelectronic element as claimed in claim 1, wherein said support walls overlie a region of said microelectronic element between said device region and said contact region.

7. The packaged microelectronic element as claimed in claim 6, wherein said microelectronic element includes an optoelectronic device and at least one second device and the support walls at least partially overlie the at least one second device.

8. The packaged microelectronic element as claimed in claim 7, wherein the support walls do not overlie the optoelectronic device.

9. The packaged microelectronic element as claimed in claim 7, wherein the support walls conduct heat between the at least one second device and the lid.

10. The packaged microelectronic element as claimed in claim 7, wherein the support walls and the lid conduct heat between (i) a first one of the at least one second device at a first location of the microelectronic element and (ii) a second one of the at least one second device at a second location of the microelectronic element.

11. The packaged microelectronic element as claimed in claim 1, further comprising a material including at least one of a solid component or a liquid component disposed between said device region at said front face and an inner surface of said lid.

12. The packaged microelectronic element as claimed in claim 11, wherein the material includes a solid component and the solid component fills spaces between the device regions and the lid wafer.

13. The packaged microelectronic element as claimed in claim 11, wherein the material includes a liquid component and the liquid component fills spaces between the device regions and the lid wafer.

14. The packaged microelectronic element as claimed in claim 11, wherein the material controls a distance between a front surface of the device wafer and an inner surface of the lid wafer.

15. The packaged microelectronic element as claimed in claim 11, wherein the material applies a stress to at least one of the lid wafer or the device wafer.

16. The packaged microelectronic element as claimed in claim 11, wherein the material functions to perform at least one of heat-spreading or impeding of heat-spreading.

17. The packaged microelectronic element as claimed in claim 11, wherein the material has an optical property different from an optical property of the lid wafer.

18. The packaged microelectronic element as claimed in claim 11, wherein the material has a refractive index different from a refractive index of the lid wafer.

19. The packaged microelectronic element as claimed in claim 11, wherein the material has a mechanical motion damping property.

20. The packaged microelectronic element as claimed in claim 11, wherein the material increases dielectric strength between the lid wafer and the device wafer.

21. The packaged microelectronic element as claimed in claim 11, wherein at least a portion of the liquid component is included in liquid lenses between the device regions and the lid wafer.

22. The packaged microelectronic element as claimed in claim 11, wherein at least a portion of the liquid component is included in microdroplets contacting the device regions, and the device regions include electrowetting devices operable to electrically alter shapes of the microdroplets.

23. The packaged microelectronic element as claimed in claim 11, wherein said support walls include an adhesive, said packaged microelectronic element further comprising a dam extending from the front face of the microelectronic element between the device region and the contact region, the dam separating the adhesive from at least some of the contacts.