Contact microscope using point source illumination
First Claim
1. A contact microscope, comprising:
- at least one point light source positioned above a specimen supporting region; and
an imager that contacts and underlies said specimen supporting region, said imager comprising;
a glass plate that forms a top surface of said imager, wherein a portion of said top surface of said glass plate comprises said specimen supporting region;
a Complementary Metal Oxide Semiconductor (CMOS) imager die located beneath said glass plate, wherein said CMOS imager die receives an optical image of said specimen that does not pass through an optical lens; and
a circuit board, which lies beneath said CMOS imager die,said specimen supporting region intersects a unidirectional path of light from said at least one point light source to said CMOS imager die.
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Accused Products
Abstract
The embodiments of the invention include a microscope having a transparent specimen holder and a digital imaging device positioned within the transparent specimen holder. The digital imaging device can include a wireless transmitter. The transparent specimen holder can have a top surface and a bottom surface, wherein the transparent specimen holder is completely transparent between the top surface and the bottom surface. Thus, the transparent specimen holder is completely transparent above and below the digital imaging device. Furthermore, a processor is operatively connected to the digital imaging device, wherein the processor produces an image of a specimen positioned on the specimen holder. A display is operatively connected to the processor, wherein the display displays the image.
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Citations
7 Claims
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1. A contact microscope, comprising:
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at least one point light source positioned above a specimen supporting region; and an imager that contacts and underlies said specimen supporting region, said imager comprising; a glass plate that forms a top surface of said imager, wherein a portion of said top surface of said glass plate comprises said specimen supporting region; a Complementary Metal Oxide Semiconductor (CMOS) imager die located beneath said glass plate, wherein said CMOS imager die receives an optical image of said specimen that does not pass through an optical lens; and a circuit board, which lies beneath said CMOS imager die, said specimen supporting region intersects a unidirectional path of light from said at least one point light source to said CMOS imager die. - View Dependent Claims (2, 3, 4, 5)
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6. A contact microscope, comprising:
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at least one point light source positioned above a specimen supporting region, wherein said at least one point light source comprises a Light Emitting Diode (LED) coupled through a first end of a thin fiber optic and a second end of said thin fiber optic is positioned above a specimen supporting region; and an imager that contacts and underlies a specimen supporting region, said imager comprising; a glass plate that forms a top surface of said imager, wherein a portion of said top surface of said glass plate comprises said specimen supporting region; a Complementary Metal Oxide Semiconductor (CMOS) imager die located beneath said glass plate, wherein said CMOS imager die receives an optical image of said specimen that does not pass through an optical lens; and a circuit board, which lies beneath said CMOS imager die, said specimen supporting region intersects a unidirectional path of light from said at least one point light source to said CMOS imager die.
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7. A contact microscope, comprising:
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at least one point light source positioned above a specimen supporting region; and an imager that contacts and underlies said specimen supporting region, said imager comprising; a glass plate that forms a top surface of said imager, wherein a portion of said top surface of said glass plate comprises said specimen supporting region; a Complementary Metal Oxide Semiconductor (CMOS) imager die located beneath said glass plate, wherein said CMOS imager die receives an optical image of said specimen that does not pass through an optical lens, and wherein said CMOS imager die comprises pixels of about 2 μ
m size; anda circuit board, which lies beneath said CMOS imager die, said specimen supporting region intersects a unidirectional path of light from said at least one point light source to said CMOS imager die.
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Specification