Acceleration sensor chip package

• US 7,938,005 B2
• Filed: 10/28/2009
• Issued: 05/10/2011
• Est. Priority Date: 10/22/2004
• Status: Active Grant

• Current Assignee: LAPIS Semiconductor Co., Ltd. (ROHM Co., Ltd.)
• Original Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Inventors: Ichikawa, Shunji
• Primary Examiner(s): Chapman; John E
• Application Number:
  US12/607,407
• Publication Number:
  US 20100043553A1
• Time in Patent Office: 559 Days
• Field of Search: 735/140.1, 735/143.3, 735/143.8
• US Class Current: 73/514.33
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Claims

1. An acceleration sensor chip package, comprising:

an acceleration sensor chip including a frame portion having an upper surface, a lower surface opposite to the upper surface, an inner region, and an outer region surrounding the inner region, an opening portion formed in the inner region and extending from the upper surface to the lower surface, a movable structure having a beam portion extending from the frame portion toward inside the opening portion and a movable portion disposed in the opening portion and supported on the beam portion to be movable, a detection element for detecting a movement of the movable structure, and an electrode pad electrically connected to the detection element and disposed in the outer region;

a sensor control chip having a first surface, a second surface opposite to the first surface, and a sensor control electrode pad disposed from the first surface, said second surface being attached to the lower surface of the frame portion;

an upper wiring portion extending on the outer region and having one end connected to the electrode pad electrically connected to the detection element;

a groove portion having a first groove portion and a second groove portion disposed in a side surface of the sensor control chip, said first groove portion extending from the upper surface to the lower surface of the frame portion, said second groove portion connected to the first groove portion and extending from the first surface to the second surface of the sensor control chip;

a side wiring portion disposed in the groove portion and having a first end and a second end, said first end being electrically connected to the other end of the upper wiring portion;

a lower wiring portion extending on the first surface of the sensor control chip and having one end connected to the second end of the side wiring portion;

a re-wring portion extending on the first surface of the sensor control chip and having one end connected to the electrode pad;

an outer terminal disposed on the first surface of the sensor control chip and connected to at least one of the other end of the lower wiring portion and the other end of the re-wiring portion;

a sealing portion for sealing the sensor control chip such that the outer terminal is exposed; and

a substrate having a recess portion for covering the movable structure and attached to the upper surface of the acceleration sensor chip such that the recess portion is situated above the movable structure.

2. The acceleration sensor chip package according to claim 1, wherein said side wiring portion is arranged such that the side wiring portion is exposed from a side surface of the frame portion.