Module and lamination process for multijunction cells

• US 7,939,454 B1
• Filed: 03/18/2009
• Issued: 05/10/2011
• Est. Priority Date: 05/31/2008
• Status: Active Grant

• Current Assignee: Stion Corporation
• Original Assignee: Stion Corporation
• Inventors: Farris, Chester A. III
• Primary Examiner(s): Nhu; David
• Application Number:
  US12/406,317
• Time in Patent Office: 783 Days
• Field of Search: 438/753, 438/311, 438/93, 438/95, 438/602, 438/603, 438/604, 438/780, 257/E21.007, 257/82, 257/115, 257/138, 257/285, 257/286, 257/289, 257/32
• US Class Current: 438/753
• CPC Class Codes: H01L 31/0201 comprising specially adapted module bus-bar structures
• CPC Class Codes: H01L 31/046 PV modules composed of a plurality of thin film solar cells deposited on the same substrate
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A method for packaging solar cell module. The method includes providing a first substrate member and forming a plurality of thin film photovoltaic cells overlying the surface region of the first substrate member. A first connector member and a second connector member having a second thickness are operably coupled to each of the plurality of thin film photovoltaic cells. A first spacer element and a second spacer element overly portions of the surface region of the first substrate member. The method provides a laminating material overlying the plurality of thin film photovoltaic cells, the spacer elements, and the connector members. A second substrate member overlies the laminating material. A lamination process is performed to form the solar cell module by maintaining a spatial gap occupied by the laminating material between an upper surface regions of the connector members and the second substrate member using the spacer elements. A planarity between the first substrate member and the second substrate member is maintained during the lamination process.

Claims

1. A method for packaging solar cell module, the method comprises:

providing a first substrate member having a surface region;

forming a plurality of thin film photovoltaic cells overlying the surface region of the first substrate member, each of the thin film photovoltaic cell having a first thickness, a first width, and a first length;

operably coupling a first connector member and a second connector member to each of the plurality of thin film photovoltaic cells, the first connector member and the second connector member having an upper surface region and a second thickness;

providing a first spacer element overlying a first portion of the surface region of the first substrate member, a second spacer element overlying a second portion of the surface region of the first substrate member, the first spacer element and the second spacer element having a third thickness;

providing a laminating material overlying the plurality of thin film photovoltaic cells, the first spacer element, the second spacer element, the first connector member, the second connector member, and exposed regions of the first substrate member;

coupling a second substrate member overlying the laminating material;

processing the first substrate member, the laminating material, and the second substrate member using a lamination process to form a photovoltaic module; and

maintaining a spatial gap occupied by a portion of the laminating material between the upper surface region and the second substrate member, using the first spacer element and the second spacer element to maintain planarity between the first substrate member and the second substrate member during the lamination process.

2. The method of claim 1 further comprises an ultraviolet curing process to cure the laminating material.

3. The method of claim 1 wherein the third thickness is greater than a total thickness of the first thickness and the second thickness.

4. The method of claim 1 wherein the first spacer element and the second spacer element are provided using printed circuit boards.

5. The method of claim 4 further comprises coupling one of the first printed circuit board and the second printed circuit board to a junction box.

6. The method of claim 1 wherein the plurality of thin film photovoltaic cells are fabricated using semiconductor metal chalcogenide material such as semiconductor metal oxides, semiconductor metal sulfides, semiconductor metal selenides, or semiconductor metal tellurides.

7. The method of claim 1 wherein the plurality of thin film photovoltaic cells are fabricated using semiconductor material comprising Group IV species.

8. The method of claim 1 wherein the first substrate member and the second substrate member are transparent substrate such as glass, quartz, fused silica, and others.

9. The method of claim 1 wherein the first connector member and the second connector member are ribbon connectors.

10. The method of claim 1 wherein the spatial gap prevents the first connector member and the second connector member, and/or the second substrate member from cracking during the laminating process.

11. The method of claim 1 wherein the connector member has a thickness of about three mils to about six mils.

12. The method of claim 1 wherein the spatial gap has a thickness of about one mil.

13. The method of claim 1 wherein the laminating material is ethyl vinyl acetate (EVA).

14. The method of claim 1 wherein the lamination process comprises:

joining the second substrate member to the first substrate using the laminating material overlying the first substrate member;

clamping the second substrate member to the first substrate member; and

providing a thermal process to couple the second substrate member to the first substrate member.

15. The method of claim 14 wherein the thermal process is provided at a temperature ranging from about 60 Degree Celsius to about 240 Degree Celsius.

16. The method of claim 14 wherein the thermal process is provided at a temperature ranging from about 80 Degree Celsius to about 150 Degree Celsius.

17. The method of claim 14 wherein the thermal process is provided in a time duration ranging about 20 minutes to about 40 minutes.

18. The method of claim 14 wherein the thermal process activates one or more of the semiconductor metal chalcogenide thin film materials for the plurality of thin film photovoltaic cells in a controlled environment and improves carrier lifetime characteristics for the one or more of the semiconductor metal chalcogenide thin film materials.

19. The method of claim 18 wherein the controlled environment can be provided using nitrogen, an inert gas, or a vacuum.