Light emitting device having light extraction structure and method for manufacturing the same

• US 7,939,840 B2
• Filed: 12/14/2009
• Issued: 05/10/2011
• Est. Priority Date: 05/08/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Electronics, Inc. (LG Corporation), LG Innotek Company Limited (LG Corporation)
• Inventors: Jang, Jun Ho, Kim, Sun Kyung, Cho, Hyun Kyong
• Primary Examiner(s): Soward; Ida M
• Application Number:
  US12/637,661
• Publication Number:
  US 20100090234A1
• Time in Patent Office: 512 Days
• Field of Search: 257/13, 257/21, 257/79, 257/436, 257/E33.067, 257/E33.072, 257/E33.074, 257/95
• US Class Current: 257/95
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: Y10S 438/977 : Thinning or removal of substrate

Abstract

A nitride-based light emitting device capable of achieving an enhancement in emission efficiency and an enhancement in reliability is disclosed. The light emitting device includes a semiconductor layer, and a light extracting layer arranged on the semiconductor layer and made of a material having a refractive index equal to or higher than a reflective index of the semiconductor layer.

Claims

1. A light emitting device comprising:

a semiconductor structure having multiple layers, the semiconductor structure having a first surface and a second surface;

a light extraction layer comprising at least two light extraction structures on the first surface of the semiconductor structure, the light extraction structures having different distributions of unit structures; and

a reflective structure on the second surface of the semiconductor structure, the reflective structure comprising an ohmic contact layer.

2. The light emitting device according to claim 1, wherein the unit structures comprise a plurality of holes or a plurality of protrusions.

3. The light emitting device according to claim 1, wherein an average distance between adjacent unit structures of the light extraction structure corresponding to the longest average distance among the light extraction structures is in the range of 800 to 5,000 nm.

4. The light emitting device according to claim 3, wherein a height or a depth of the unit structure is in the range of 300 to 3,000 nm.

5. The light emitting device according to claim 1, wherein an average distance between adjacent unit structures of the light extraction structure corresponding to the shortest average distance among the light extraction structures is in the range of 50 to 1,000 nm.

6. The light emitting device according to claim 5, wherein a height or a depth of the unit structure is in the range of 50 to 500 nm.

7. The light emitting device according to claim 1, wherein a height or a depth of the unit structure is in the range of 0.1a to 0.45a, where “

a”

represents an average distance between adjacent unit structures of the light extraction structure.

8. The light emitting device according to claim 1, wherein the semiconductor structure comprises:

a p-type semiconductor layer;

an active layer arranged on the p-type semiconductor layer; and

an n-type semiconductor layer arranged on the active layer.

9. The light emitting device according to claim 8, wherein the light extraction layer is formed on the n-type semiconductor layer.

10. The light emitting device according to claim 1 further comprising:

a support layer on the reflective structure.

11. The light emitting device according to claim 10, wherein the support layer comprises a semiconductor or a metal.

12. The light emitting device according to claim 1, wherein the light extraction layer comprises:

a first light extraction structure having a first average distance between adjacent unit structures; and

a second light extraction structure having a second average distance between adjacent unit structures,

wherein the first average distance is longer than the second average distance.

13. The light emitting device according to claim 12, wherein the first light extraction structure comprises a plurality of holes.

14. The light emitting device according to claim 13, wherein the second light extraction structure is formed in the holes of the first light extraction structure.

15. The light emitting device according to claim 13, wherein the second light extraction structure is formed on the outside of the holes of the first light extraction structure.

16. The light emitting device according to claim 12, wherein the second light extraction structure comprises a plurality of protrusions.

17. The light emitting device according to claim 12, wherein the second light extraction structure overlaps the first light extraction structure.

18. The light emitting device according to claim 1, wherein the reflective structure is a single layer.

19. The light emitting device according to claim 1, wherein the light extraction structures are formed on the first surface of the semiconductor structure.

20. The light emitting device according to claim 19, wherein the light extraction structures are formed by etching the first surface of the semiconductor structure.

21. The light emitting device according to claim 1, wherein the light extraction layer comprises the same material as that of the semiconductor structure.

22. A light emitting device comprising:

a semiconductor structure having multiple layers; and

a light extraction layer on the semiconductor structure, the light extraction layer comprising a first light extraction structure having a periodic distribution of unit structures and a second light extraction structure having a random distribution of unit structures.

23. The light emitting device according to claim 22, wherein the second light extraction structure has an average distance between adjacent unit structures shorter than a periodicity of the first extraction structure.

24. The light emitting device according to claim 22 wherein the first light extraction structure and the second light extraction structure are formed on the semiconductor structure.

25. The light emitting device according to claim 24, wherein the first light extraction structure and the second light extraction structure are formed by etching the semiconductor structure.

26. The light emitting device according to claim 22, wherein a periodicity of the first light extraction structure is in the range of 800 to 5,000 nm.

27. The light emitting device according to claim 22, wherein a height or a depth of the unit structure of the first light extraction structure is in the range of 300 to 3,000 nm.

28. The light emitting device according to claim 22, wherein an average distance between adjacent unit structures of the second light extraction structure is in the range of 50 to 1,000 nm.

29. The light emitting device according to claim 22, wherein a height or a depth of the unit structure of the second light extraction structure is in the range of 50 to 500 nm.

30. The light emitting device according to claim 22, wherein the second light extraction structure overlaps the first light extraction structure.

31. The light emitting device according to claim 22, wherein the light extraction layer comprises the same material as that of the semiconductor structure.