Device having inductors and capacitors

• US 7,939,909 B2
• Filed: 01/22/2007
• Issued: 05/10/2011
• Est. Priority Date: 03/05/2002
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Moon-chul, Hong, Jeong-yoo, Hong, Young-tack, Jeong, Sung-hye, Hong, Byung-yoo, Song, In-sang
• Primary Examiner(s): Hu; Shouxiang
• Application Number:
  US11/655,915
• Publication Number:
  US 20070115702A1
• Time in Patent Office: 1,569 Days
• Field of Search: 257/531, 257/532, 257/533, 257/E21.022, 257/E21.048
• US Class Current: 257/531
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 27/0744 without components of the field effect type
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03H 2001/0078 comprising spiral inductor on a substrate
• CPC Class Codes: H03H 2001/0085 Multilayer, e.g. LTCC, HTCC, green sheets inside PCB filters H05K
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/1006 Non-printed filter
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

An LC device having a substrate, a support layer having upper and lower sides formed on the substrate, inductors formed on either the upper or lower side of the support layer, and capacitors formed in the opposite side of the support layer. The support layer may be formed of a low-k dielectric material, and a connection portion may be provided to connect the inductors and capacitors in the support layer. The inductors and capacitors are disposed in a stacked structure on the upper and lower sides of the low-k dielectric support layer on the substrate, so that space efficiency may be maximized on the substrate. The low-k dielectric support layer provides support between the inductors and capacitors so that substrate loss is minimized and a Q factor of the inductors is enhanced.

Claims

1. An LC device, comprising:

a patterned substrate including a hollow space;

a support layer having an upper side and a lower side on the substrate and the hollow space, the upper side and the lower side of the support layer being opposite each other, and the lower side of the support layer facing the substrate;

at least a portion of at least one inductor on either the upper side or the lower side of the support layer; and

at least a portion of at least one capacitor on the side of the support layer that is opposite the side on the which the at least one inductor is formed,

wherein one of the at least one inductor and the at least one capacitor is partially embedded in the support layer and partially protrudes from the lower side of the support layer, and

wherein at least a portion of the hollow space laterally extends from inner side surfaces that face one another of the substrate and is defined between the inner side surfaces of the substrate, at least a portion of the lower side of the support layer and the partially protruding portion of the at least one inductor or the at least one capacitor.

2. The LC device as claimed in claim 1, wherein the support layer includes a material having a low dielectric constant.

3. The LC device as claimed in claim 2, wherein the material of the support layer having a low dielectric constant is bicyclobutene (BCD) or a polymer-series substance.

4. The LC device as claimed in claim 1, wherein the support layer is supported by the substrate, and the hollow space of the substrate is between inner facing surfaces of the patterned substrate, the at least one inductor or capacitor on the lower side of the support layer being exposed to the air in the hollow space between the inner facing surfaces of the patterned substrate, and the at least one inductor or capacitor on the lower side of the support layer being spaced apart from the inner facing surfaces of the patterned substrate along a horizontal direction, the horizontal direction being substantially parallel to the support layer.

5. The LC device as claimed in claim 1, further comprising a connection portion through the support layer for electrically connecting the at least one inductor and the at least one capacitor on the upper and lower sides of the support layer.

6. The LC device as claimed in claim 1, wherein the at least one inductor and the at least one capacitor on the upper and lower sides of the support layer have a stacked structure relative to each other.

7. The LC device as claimed in claim 1, wherein at least a portion of one of the at least one inductor and the at least one capacitor is in the support layer.

8. The LC device as claimed in claim 7, wherein a portion of all of inductors or capacitors is in the support layer.

9. The LC device as claimed in claim 7, wherein a portion of one of each inductor and capacitor is in the support layer.

10. The LC device as claimed in claim 1, wherein the substrate is one of a semiconductor and a dielectric.

11. The LC device as claimed in claim 10, wherein the substrate is silicon.

12. The LC device as claimed in claim 1, wherein the at least one capacitor is on the upper side of the support layer and the at least one inductor is on the lower side of the support layer.

13. The LC device as claimed in claim 12, wherein the at least one capacitor extends across the at least one inductor.

14. The LC device as claimed in claim 13, further comprising at least two inductors, wherein the at least one capacitor extends across the at least two inductors.

15. The LC device as claimed in claim 1, wherein the at least one inductor is on the upper side of the support layer and the at least one capacitor is on the lower side of the support layer.

16. The LC device as claimed in claim 15, wherein the at least one capacitor extends across the at least one inductor.

17. The LC device as claimed in claim 16, further comprising at least two inductors, wherein the at least one capacitor extends across the at least two inductors.

18. The LC device as claimed in claim 1, wherein the hollow space in the patterned substrate extends through the entire substrate along a vertical direction, the vertical direction being perpendicular to the support layer.

19. The LC device as claimed in claim 18, wherein the support layer overlaps the entire hollow space of the patterned substrate.