Organic EL device panel and method for manufacturing the same

• US 7,940,000 B2
• Filed: 10/29/2008
• Issued: 05/10/2011
• Est. Priority Date: 10/30/2007
• Status: Expired due to Fees

• Current Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Inventors: Koshiyama, Yoshiki
• Primary Examiner(s): Patel; Ashok
• Application Number:
  US12/260,854
• Publication Number:
  US 20090108745A1
• Time in Patent Office: 923 Days
• Field of Search: None
• US Class Current: 313/504
• CPC Class Codes: H10K 50/17 Carrier injection layers
• CPC Class Codes: H10K 50/171 Electron injection layers
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8428 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals

Abstract

An organic EL device panel includes an organic EL device substrate including a substrate, a plurality of organic EL devices which are formed on the substrate, and a plurality of wirings for driving the organic EL devices, a sealing substrate which covers the organic EL devices, and a sealing material which is used for attaching the organic EL device substrate to the sealing substrate, wherein space for placing the sealing material includes a region having a sealing space where there is an overhead crossing of wirings, and wherein the organic EL device substrate is attached to the sealing substrate by a sealing material without a spacer in the region where there is the overhead crossing of wirings.

Claims

1. An organic EL device panel, comprising:

an organic EL device substrate, comprising;

a substrate,

a plurality of organic EL devices which are formed on the substrate, and

a plurality of wirings for driving the organic EL devices;

a sealing substrate which covers the organic EL devices; and

a sealing material which is used for attaching the organic EL device substrate to the sealing substrate,

wherein a space for placing the sealing material includes a region having a sealing space where there is an overhead crossing of wirings,

wherein the organic EL device substrate is attached to the sealing substrate by the sealing material without a spacer in the region where there is the overhead crossing of wirings,

and

wherein the organic EL device substrate is attached to the sealing substrate by the sealing material including spacers in a region having a sealing space where there is no overhead crossing of wirings.

2. The organic EL device panel according to claim 1,

wherein a desiccant is arranged inside the sealing substrate.

3. The organic EL device panel according to claim 1,

wherein the sealing material is a heat curing type adhesive or a light curing type adhesive.

4. A method for manufacturing an organic EL device panel, comprising:

forming an organic EL device substrate with a plurality of wirings for driving organic EL devices;

preparing a sealing substrate for covering the organic EL devices; and

attaching the organic EL device substrate to the sealing substrate by a sealing material,

wherein space for placing the sealing material includes a region having a sealing space where there is an overhead crossing of wirings,

wherein the organic EL device substrate is attached to the sealing substrate by the sealing material without a spacer in the region where there is the overhead crossing of wirings,

and

wherein the organic EL device substrate is attached to the sealing substrate by the sealing material including spacers in a region having a sealing space where there is no overhead crossing of wirings.

5. The method for manufacturing an organic EL device panel according to claim 4,

wherein the sealing material is a heat curing type adhesive or a light curing type adhesive.

6. The method for manufacturing an organic EL device panel according to claim 4,

wherein a desiccant is arranged inside the sealing substrate.