Rigid-backed, membrane-based chip tooling
First Claim
1. An apparatus for use with multiple individual chips, the apparatus comprising:
- a rigid plate; and
a deformable material located on the rigid plate, wherein a first surface of the deformable material is in contact with a surface of the rigid plate along its length, and wherein the deformable material includes a ceramic;
wherein a second surface of the deformable material, opposite the first surface, is configured to peripherally conform to only a top end portion of each of the multiple individual chips, irrespective of any difference in height among the multiple individual chips, to prevent each of the multiple individual chips from moving in a lateral direction, and to uniformly transfer a vertical force, applied to the rigid plate, to the multiple individual chips to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the multiple individual chips will be bonded during a connect-and-release cycle without causing damage to the multiple individual chips or the bonding surface.
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Accused Products
Abstract
An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.
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Citations
24 Claims
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1. An apparatus for use with multiple individual chips, the apparatus comprising:
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a rigid plate; and a deformable material located on the rigid plate, wherein a first surface of the deformable material is in contact with a surface of the rigid plate along its length, and wherein the deformable material includes a ceramic; wherein a second surface of the deformable material, opposite the first surface, is configured to peripherally conform to only a top end portion of each of the multiple individual chips, irrespective of any difference in height among the multiple individual chips, to prevent each of the multiple individual chips from moving in a lateral direction, and to uniformly transfer a vertical force, applied to the rigid plate, to the multiple individual chips to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the multiple individual chips will be bonded during a connect-and-release cycle without causing damage to the multiple individual chips or the bonding surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 21, 22)
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16. A tooling system for a wafer bonding process, the system comprising:
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a rigid plate; and a membrane disposed on and in continuous contact with the rigid plate on a first side, wherein the membrane includes a deformable material that is configured to peripherally conform to only a top end portion of each of the plurality of chips on a second side, opposite the first side, irrespective of any difference in height among the plurality of chips, and further configured to prevent each of the plurality of chips from moving in a lateral direction; wherein the membrane is further configured to uniformly transfer a vertical force from the rigid plate to the plurality of chips, and wherein the deformable material includes a ceramic. - View Dependent Claims (17, 18, 19, 20, 23, 24)
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Specification