Substrate cleaning chamber and components

• US 7,942,969 B2
• Filed: 09/19/2007
• Issued: 05/17/2011
• Est. Priority Date: 05/30/2007
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Riker, Martin, Wang, Wei W.
• Primary Examiner(s): ROBINSON, DANIEL LEON
• Application Number:
  US11/857,975
• Publication Number:
  US 20080295872A1
• Time in Patent Office: 1,336 Days
• Field of Search: 118/715, 118716-733, 219/385, 392/416
• US Class Current: 118/715
• CPC Class Codes: H01J 2237/0213 Avoiding deleterious effects due to interactions between particles and tube elements
• CPC Class Codes: H01J 2237/0268 Liner tubes
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01J 2237/335 Cleaning
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32477 characterised by the means for protecting vessels or internal parts, e.g. coatings
• CPC Class Codes: H01J 37/32724 Temperature
• CPC Class Codes: H01J 37/32871 Means for trapping or directing unwanted particles
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A substrate cleaning chamber comprises various components, such as for example, a consumable ceramic liner, substrate heating pedestal, and process kit. The consumable ceramic liner is provided for connecting a gas outlet channel of a remote gas energizer to a gas inlet channel of a substrate cleaning chamber. The substrate heating pedestal comprises an annular plate having a substrate receiving surface with a plurality of ceramic balls positioned in an array of recesses. A process kit comprises a top plate, top liner, gas distributor plate, bottom liner, and focus ring.

Claims

1. A gas distributor plate for a substrate process chamber, the gas distributor plate comprising:

(a) a first ring of first holes that each have a diameter d;

(b) a second ring of second holes that each have a diameter 2d, the second ring being radially outward of the first ring;

(c) a third ring of third holes that each have a diameter 3d, the third ring being radially outward of the second ring; and

(d) a fourth ring of fourth holes that each have a diameter 4d, the fourth ring being radially outward of the third ring.

2. A gas distributor plate according to claim 1 wherein the diameter d is from about 1 to about 5 mm.

3. A gas distributor plate according to claim 1 wherein the second holes have a diameter of from about 2 to about 10 mm.

4. A gas distributor plate according to claim 1 wherein the third holes have a diameter of from about 3 to about 15 mm.

5. A gas distributor plate according to claim 1 wherein the fourth holes have a diameter of from about 4 to about 20 mm.

6. A gas distributor plate according to claim 1 composed of a ceramic.

7. A gas distributor plate according to claim 6 wherein the ceramic comprises aluminum oxide or silicon oxide.

8. A gas distributor plate according to claim 1 composed of quartz.

9. A gas distributor plate according to claim 1 wherein the fourth ring comprises a larger number of holes than the third ring.

10. A gas distributor plate according to claim 1 wherein the first ring or second ring comprises a smaller number of holes than the fourth ring.

11. A gas distributor plate for a substrate process chamber, the gas distributor plate comprising:

(a) a first ring of first holes that each have a diameter d of from about 1 to about 5 mm;

(b) a second ring of second holes that each have a diameter 2d of from about 2 to about 10 mm, the second ring being radially outward of the first ring;

(c) a third ring of third holes that each have a diameter 3d of from about 3 to about 15 mm, the third ring being radially outward of the second ring; and

(d) a fourth ring of fourth holes that each have a diameter 4d of from about 4 to about 20 mm, the fourth ring being radially outward of the third ring.

12. A gas distributor plate according to claim 11 composed of a ceramic.

13. A gas distributor plate according to claim 11 wherein the ceramic comprises aluminum oxide or silicon oxide.

14. A gas distributor plate according to claim 11 composed of quartz.

15. A gas distributor plate according to claim 11 wherein the fourth ring comprises a larger number of holes than the third ring.

16. A gas distributor plate according to claim 11 wherein the first ring or second ring comprises a smaller number of holes than the fourth ring.

20. A gas distributor plate according to claim 11 composed of quartz.

21. A gas distributor plate according to claim 11 wherein the fourth ring comprises a larger number of holes than third ring.

22. A gas distributor plate according to claim 11 wherein the first ring or second ring comprises a smaller number of holes than the fourth ring.

17. A gas distributor plate for a substrate process chamber, the gas distributor plate comprising:

(a) a first ring of first holes that each have a diameter of from about 1 to about 5 mm;

(b) a second ring of second holes that each have a diameter of from about 2 to about 10 mm, the second ring being radially outward of the first ring;

(c) a third ring of third holes that each have a diameter of from about 3 to about 15 mm, the third ring being radially outward of the second ring; and

(d) a fourth ring of fourth holes that each have a diameter of from about 4 to about 20 mm, the fourth ring being radially outward of the third ring.

18. A gas distributor plate according to claim 17 composed of a ceramic.

19. A gas distributor plate according to claim 17 wherein the ceramic comprises aluminum oxide or silicon oxide.