Method and structure of expanding, upgrading, or fixing multi-chip package
First Claim
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1. A system, comprising:
- a multi-chip package (MCP) having a plurality of dies, a bottom package substrate for interfacing with a printed circuit board (PCB), and a top package substrate serving as an interface between the MCP and an add-on package, wherein the plurality of dies are stacked between the bottom and top substrates along an axis perpendicular to the bottom and top package substrates; and
the add-on package attached to the multi-chip package to alter functionality of the multi-chip package, wherein the add-on package is located above the top package substrate on the axis.
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Abstract
Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.
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Citations
20 Claims
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1. A system, comprising:
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a multi-chip package (MCP) having a plurality of dies, a bottom package substrate for interfacing with a printed circuit board (PCB), and a top package substrate serving as an interface between the MCP and an add-on package, wherein the plurality of dies are stacked between the bottom and top substrates along an axis perpendicular to the bottom and top package substrates; and the add-on package attached to the multi-chip package to alter functionality of the multi-chip package, wherein the add-on package is located above the top package substrate on the axis. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A multi-chip package (MCP), comprising:
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a bottom package substrate for interfacing with a printed circuit board (PCB); a top package substrate serving as an interface between the MCP and an add-on package; a plurality of dies, the dies stacked between the bottom and top substrates along an axis perpendicular to the bottom and top package substrates; and a sensing circuit for detecting the presence of the add-on package attached to the multi-chip package to alter functionality of the multi-chip package, wherein the add-on package is located above the top package substrate on the axis. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method, comprising:
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sensing, by a multi-chip package (MCP), the attachment of an add-on package to a top package substrate of the MCP, wherein the add-on package is located above the top package substrate on an axis perpendicular to the top package substrate; and altering functionality of the MCP in response to sensing the attachment of the add-on package. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A method, comprising:
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sensing the attachment of an add-on package to a top package substrate of a multi-chip package (MCP); communicating to a controller to inform new functionality is available, wherein communicating to the controller is accomplished by changing jumper settings on a PCB; and altering functionality of the MCP in response to sensing the attachment of the add-on package.
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Specification