Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
First Claim
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1. Apparatus for testing a semiconductor device under test (DUT), comprising:
- an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits by selectively connecting the at least one of the dedicated test circuits to at least one of the test probes while selectively disconnecting at least another one of the dedicated test circuits from the test probes,wherein each of a plurality of the dedicated test circuits is configured to perform a different test on the DUT.
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Abstract
Methods and apparatus for providing a tester integrated circuit (IC) for testing a semiconductor device under test (DUT) are described. Examples of the invention can relate to an apparatus for testing a semiconductor device under test (DUT). In some examples, the apparatus can include an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits.
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Citations
23 Claims
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1. Apparatus for testing a semiconductor device under test (DUT), comprising:
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an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits by selectively connecting the at least one of the dedicated test circuits to at least one of the test probes while selectively disconnecting at least another one of the dedicated test circuits from the test probes, wherein each of a plurality of the dedicated test circuits is configured to perform a different test on the DUT. - View Dependent Claims (6, 7, 21)
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2. Apparatus for testing a semiconductor device under test (DUT), comprising:
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an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits, wherein the programmable logic comprises a programmable interconnect fabric, and wherein the dedicated test circuits are coupled to input/output (IO) ports of the programmable interconnect fabric. - View Dependent Claims (3, 4, 5)
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8. Apparatus for testing a semiconductor device under test (DUT), comprising:
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a probe card assembly having input terminals coupled to test probes via signal paths, the test probes configured to contact pads on the DUT; and test instruments, coupled to the input terminals, the test instruments including at least one tester integrated circuit (IC), each of the at least one tester IC coupled to one or more of the input terminals and including; a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits by selectively connecting the at least one of the dedicated test circuits to at least one of the test probes while selectively disconnecting at least another one of the dedicated test circuits from the test probes, wherein each of a plurality of the dedicated test circuits is configured to perform a different test on the DUT. - View Dependent Claims (13, 14, 22)
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9. Apparatus for testing a semiconductor device under test (DUT), comprising:
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an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits, wherein the programmable logic comprises a programmable interconnect fabric, and wherein the dedicated test circuits are coupled to input/output (TO) ports of the programmable interconnect fabric. - View Dependent Claims (10, 11, 12)
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15. A probe card assembly, comprising:
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signal paths coupled to test probes, the test probes configured to contact pads on a semiconductor device under test (DUT); and at least one tester integrated circuit (IC) coupled one or more of the signal paths and including; a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits by selectively connecting the at least one of the dedicated test circuits to at least one of the test probes while selectively disconnecting at least another one of the dedicated test circuits from the test probes, wherein each of a plurality of the dedicated test circuits is configured to perform a different test on the DUT. - View Dependent Claims (19, 20, 23)
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16. Apparatus for testing a semiconductor device under test (DUT), comprising:
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an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits, wherein the programmable logic comprises a programmable interconnect fabric, and wherein the dedicated test circuits are coupled to input/output (IO) ports of the programmable interconnect fabric. - View Dependent Claims (17, 18)
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Specification