Flash memory device assembly using adhesive

• US 7,944,703 B2
• Filed: 04/03/2008
• Issued: 05/17/2011
• Est. Priority Date: 09/29/2004
• Status: Expired due to Fees

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Ni, Jim Chin-Nan, Nan, Nan, Ma, Abraham C., Yu, I-Kang
• Primary Examiner(s): Levi; Dameon E
• Assistant Examiner(s): NGUYEN, HOA CAO
• Application Number:
  US12/062,464
• Publication Number:
  US 20080212297A1
• Time in Patent Office: 1,139 Days
• Field of Search: 361/752, 361/737, 361/730, 361/715, 361/600, 361/719, 361/728, 361/713, 361/720, 361/736, 361/732, 361/741, 174/50.52, 174/50.5, 174/259, 257/726, 257/727, 298/32, 298/30, 298/54
• US Class Current: 361/752
• CPC Class Codes: G06F 12/1416 by checking the object accessibility, e.g. type of access defined by the memory independently of subject rights G06F12/1458 takes precedence
• CPC Class Codes: G06F 21/32 using biometric data, e.g. fingerprints, iris scans or voiceprints
• CPC Class Codes: G06F 21/78 to assure secure storage of data address-based protection against unauthorised use of memory G06F12/14; record carriers for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: G06K 19/07 with integrated circuit chips
• CPC Class Codes: G06K 19/07354 by biometrically sensitive means, e.g. fingerprint sensitive fingerprint sensors in general G06V40/12; biometrically activated access control G07C9/25
• CPC Class Codes: G06V 40/1365 Matching; Classification
• CPC Class Codes: G07C 9/257 electronically G07C9/26 takes precedence
• CPC Class Codes: H05K 5/026 having standardized interfaces flash memory cards G06K19/077
• CPC Class Codes: H05K 5/0269 Card housings therefor, e.g. covers, frames, PCB
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.

Claims

1. A flash memory device comprising:

a printed circuit board assembly (PCBA) including a printed circuit board (PCB), a connector disposed on a front edge of the PCB, and a plurality of integrated circuit (IC) devices mounted onto one or more surfaces of the PCB;

a frame including first and second parallel side rails and a back end rail extending between first ends of the first and second side rails, wherein the frame defines at least one front end opening;

at least one panel disposed on the side rails and end rail of the frame such that the at least one panel extends over a first surface of the PCBA; and

at least one thermal bonding film securing the at least one panel to at least one of the PCBA and the frame such that the at least one panel and the frame form a housing that surround the PCBA such that the connector is exposed through the at least one front end opening,

wherein the at least one panel is attached to one of the frame and the PCBA solely by said at least one thermal bonding film.

2. The flash memory device according to claim 1, wherein the at least one panel is secured to upper surfaces of said plurality of IC devices by a first thermal bonding film.

3. The flash memory device according to claim 1, wherein the at least one panel is secured to the frame by a first peripheral thermal bonding film.

4. The flash memory device according to claim 1, wherein said first and second parallel side rails and back end rail of said frame define a shallow recess, and said at least one panel is received in said shallow recess such that an upper surface of the at least one panel is flush with the outer peripheral portions of frame.

5. The flash memory device according to claim 1, wherein the at least one panel includes a first panel disposed on a first side of the frame and attached to one of the frame and the PCBA by a first thermal bonding film, and a second panel disposed on a second side of the frame and attached to one of the frame and the PCBA by a second thermal bonding film.

6. The flash memory device according to claim 1, wherein the frame comprises a first panel that is integrally formed with the side rails, and a second panel that is attached to one of the frame and the PCBA solely by said at least one thermal bonding film.

7. The flash memory device according to claim 1, wherein the frame comprises a first frame portion, a first panel that is integrally formed with first side rail portions of the first frame portion, a second frame portion, and a second panel that is integrally formed with second side rail portions of the second frame portion, and

wherein the first panel is attached to the PCBA solely by a first thermal bonding film, and the second panel is attached to the PCBA solely by a second thermal bonding film.

8. The flash memory device according to claim 1, wherein the at least one panel comprises metal.

9. The flash memory device according to claim 1, wherein the PCBA complies with one of a Serial Advanced Technology Attachment (SATA), micro SATA, Secure Digital (SD), micro SD, Integrated Drive Electronics (IDE), PCI Express, Universal Serial Bus (USB), Memory Stick, and Zero Insertion Force (ZIF) specification.

10. A flash memory device comprising:

a printed circuit board assembly (PCBA) including a printed circuit board (PCB), a connector disposed on a front edge of the PCB, and a plurality of integrated circuit (IC) devices mounted onto one or more surfaces of the PCB;

a frame including first and second parallel side rails and a back end rail extending between first ends of the first and second side rails, wherein the frame defines at least one front end opening;

at least one panel disposed on the side rails and end rail of the frame such that the at least one panel extends over a first surface of the PCBA; and

at least one thermal bond adhesive layer securing the at least one panel to at least one of the PCBA and the frame such that the at least one panel and the frame form a housing that surround the PCBA such that the connector is exposed through the at least one front end opening,

wherein the at least one panel is attached to one of the frame and the PCBA solely by said at least one thermal bond adhesive layer, and

wherein the flash memory device further comprises one of an electrically insulating layer, a thermally conductive layer, and a conformal coating layer disposed between the plurality of IC devices and the at least one panel and in contact with said at least one thermal bond adhesive layer.

11. A method for manufacturing a flash memory device comprising:

forming a printed circuit board assembly (PCBA) including a plurality of integrated circuit (IC) devices, and a housing including a frame and at least one panel;

mounting the PCBA inside of the frame;

applying a thermal bonding film to one of;

(a) an upper surface of at least one of the plurality of IC devices, (b) the frame, and (c) an inside surface of said at least one panel;

mounting the PCBA inside the housing such that only a connector of the PCBA is exposed outside of the housing;

mounting the frame, the PCBA, and the at least one panel into a fixture such that the thermal bonding film is pressed between the panel and at least one of the PCBA and the frame;

heating the fixture to a first relatively high temperature such that an adhesive disposed on the thermal bonding film is activated; and

cooling the fixture to a second, relatively low temperature.

12. The method according to claim 11, wherein mounting the at least one panel comprises mounting first and second panels over opposing sides of the PCBA such that each panel is secured to corresponding IC devices of said plurality of IC devices that are disposed on said opposing sides of the PCBA.

13. The method according to claim 11, wherein mounting the at least one panel comprises mounting first and second panels over opposing sides of the frame such that each panel is secured to corresponding sides of the frame by first and second thermal bonding films.

14. The method according to claim 11, wherein mounting the frame, the PCBA, and the at least one panel into the fixture further comprises placing the at least one panel, the PCBA and the frame into a recess formed in the fixture, and manipulating a spring clamp such that the at least one panel is pressed against the upper surface of said at least one of the plurality of IC devices.