Pin-type chip tooling
First Claim
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1. An apparatus for bonding multiple chips with an element, the apparatus comprising:
- a plurality of posts; and
a frame configured to releasably constrain the plurality of posts, wherein the frame is substantially orthogonal to the plurality of posts and the plurality of posts are configured to pass through the frame;
wherein at least some of the plurality of posts are configured to contact top surfaces of the multiple chips when unconstrained by the frame despite variations in heights of the multiple chips;
wherein the apparatus is configured to constrain the plurality of posts relative to the frame and apply a substantially uniform force to the multiple chips that is appropriate for bonding the multiple chips to the element; and
wherein the plurality of posts are configured to pass through the frame along an axis that is substantially orthogonal to the frame, and wherein the at least some of the plurality of posts are further configured to tilt away from the axis.
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Abstract
An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.
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Citations
26 Claims
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1. An apparatus for bonding multiple chips with an element, the apparatus comprising:
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a plurality of posts; and a frame configured to releasably constrain the plurality of posts, wherein the frame is substantially orthogonal to the plurality of posts and the plurality of posts are configured to pass through the frame; wherein at least some of the plurality of posts are configured to contact top surfaces of the multiple chips when unconstrained by the frame despite variations in heights of the multiple chips; wherein the apparatus is configured to constrain the plurality of posts relative to the frame and apply a substantially uniform force to the multiple chips that is appropriate for bonding the multiple chips to the element; and wherein the plurality of posts are configured to pass through the frame along an axis that is substantially orthogonal to the frame, and wherein the at least some of the plurality of posts are further configured to tilt away from the axis. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A system for bonding multiple chips having bonding surfaces to an element having a bonding surface, the system comprising:
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multiple chips having a plurality of bonding surfaces; an element having a second bonding surface; and a bonding apparatus including; a plurality of posts; and a frame configured to releasably constrain the plurality of posts, wherein the frame is substantially orthogonal to the plurality of posts, and wherein the plurality of posts are configured to pass through the frame; wherein at least some of the multiple chips have different heights; wherein at least some of the plurality of posts conform to the different heights and are configured to contact the multiple chips; wherein the at least some of the plurality of posts, when constrained by the frame, are configured to apply a substantially uniform force to the multiple chips to bring the plurality of bonding surfaces of the multiple chips into contact with the second bonding surface of the element; and wherein the plurality of posts are configured to pass through the frame along an axis that is substantially orthogonal to the frame, and wherein the at least some of the plurality of posts are further configured to tilt away from the axis. - View Dependent Claims (23, 24, 25, 26)
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Specification