×

Thermocouple

  • US 7,946,762 B2
  • Filed: 06/17/2008
  • Issued: 05/24/2011
  • Est. Priority Date: 06/17/2008
  • Status: Active Grant
First Claim
Patent Images

1. A thermocouple for use in a semiconductor processing reactor, said thermocouple comprising:

  • a sheath;

    a support member at least partially disposed within said sheath, said support member having a first bore and a second bore formed substantially parallel to a longitudinal axis of said support member;

    a first cut-out formed into said support member that intersects with said first bore at a location spaced apart from an end of said support member such that said first bore extends less than a length of said support member;

    a first wire disposed within said first bore;

    a second wire disposed within said second bore, said second wire formed of a dissimilar metal than said first wire;

    a second cut-out formed in said support member,wherein said first wire exiting said first bore at an intersection between said first bore and said first cut-out and said second wire exiting said second bore at an intersection between said second bore and said second cut-out;

    a junction formed between an end of said first wire and an end of said second wire, wherein said junction is located adjacent to an end of said support member;

    a first loop formed by a portion of said first wire adjacent to a location at which said first wire exits said first bore adjacent to an end of said support member opposite said junction; and

    a second loop formed by a portion of said second wire adjacent to a location at which said second wire exits said second bore adjacent to an end of said support member opposite said junction;

    wherein said first and second loops are configured to allow said first and second wires to freely thermally expand in a longitudinal manner within said support member.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×