Nanomachining method and apparatus

• US 7,947,952 B1
• Filed: 03/26/2007
• Issued: 05/24/2011
• Est. Priority Date: 03/08/2001
• Status: Expired due to Fees

• Current Assignee: Terraspan LLC
• Original Assignee: General Nanotechnology LLC
• Inventors: Kley, Victor B.
• Primary Examiner(s): Johnston; Phillip A
• Application Number:
  US11/728,744
• Time in Patent Office: 1,520 Days
• Field of Search: 250/307
• US Class Current: 250/307
• CPC Class Codes: B24B 37/11 Lapping tools
• CPC Class Codes: G01Q 30/04 Display or data processing devices
• CPC Class Codes: G01Q 80/00 Applications, other than SPM, of scanning-probe techniques manufacture or treatment of nanostructures B82B3/00; recording or reproducing information using near-field interaction G11B9/12, G11B11/24, G11B13/08

Abstract

Methods and apparatus are disclosed for nanomachining operations. Excitation energy settings are provided to minimize machine induced scan cutting. Cut operations can be operated in a feedback mode to provide controlled cutting operations. Measurement and sweep techniques to facilitate nanomachining operations are disclosed.

Claims

1. In a nanomachining system having an SPM scanning probe and a translation apparatus coupled to provide translational motion of the SPM scanning probe, a method for moving material in a region of a workpiece, the method comprising:

performing one or more cut operations on a region of a workpiece, the one or more cut operations producing a deposit of debris in the region of the workpiece; and

removing the deposit of debris entirely from the region of the workpiece to another location including performing steps of;

(a) positioning the SPM scanning probe at a sweep-start position in the region of the workpiece, the sweep-start position lying on a first reference line;

(b) adjusting the SPM scanning probe along the Z-direction to a first Z-direction position;

(c) moving a first portion of the deposit of debris in a direction substantially orthogonal to the first reference line by translating the SPM scanning probe in a direction substantially orthogonal to the first reference line on which the sweep-start position lies; and

(d) moving additional portions of the deposit of debris by repeating steps (a)-(c) using additional sweep-start positions along the first reference line and by adjusting the Z-direction position of the SPM scanning probe.

2. The method of claim 1 wherein the region is a region being nanomachined.

3. The method of claim 1 wherein, in step (c), the scanning probe moves away from the sweep-start position along a substantially straight line of motion.

4. The method of claim 1 wherein, in step (c), the scanning probe moves away from the sweep-start position along a line of motion having a zig-zag pattern.

5. The method of claim 1 further comprising:

(e) moving still further additional portions of the deposit of debris in a direction substantially orthogonal to a second reference line by positioning the SPM scanning probe at a sweep-start position lying on the second reference line and performing steps (a)-(d) for the second reference line.

6. A nanomachining system comprising:

an SPM scanning probe;

a translation apparatus coupled to the SPM scanning probe to provide translational motion of the SPM scanning probe;

a controller coupled to operate the translation apparatus, the controller configured to;

perform one or more cut operations on a region of a workpiece, the one or more cut operations producing a deposit of debris in the region of the workpiece; and

remove the deposit of debris entirely from the region of the workpiece to another location including performing steps of;

(a) positioning the SPM scanning probe at a sweep-start position in a region of the workpiece, the sweep-start position lying on a first reference line, the first reference line being one among a plurality of reference lines passing through a common point of origin in the region;

(b) adjusting the SPM scanning probe along the Z-direction to a first Z-direction position;

(c) moving a first portion of the deposit of debris in a direction substantially orthogonal to the first reference line by translating the SPM scanning probe in a direction substantially orthogonal to the first reference line on which the sweep-start position lies; and

(d) moving additional portions of the deposit of debris by repeating (a)-(c) using additional sweep-start positions along the first reference line and by adjusting the Z-direction position of the SPM scanning probe.

7. The nanomachining system of claim 6 wherein the controller is further configure to move still further additional portions of the deposit of debris in a direction substantially orthogonal to a second reference line by positioning the SPM scanning probe at a sweep-start position lying on the second reference line and performing (a)-(d) for the second reference line.

8. A computer-program product embodied on a tangible computer-readable storage medium comprising program code configured to cause a computerized controller to operate an SPM scanning probe, the computer program code comprising:

first computer instructions which, when executed by the computerized controller, cause the computerized controller to;

perform one or more cut operations on are ion of a workpiece, the one or more cut operations producing a deposit of debris in the region of the workpiece; and

remove the deposit of debris entirely from the region of the workpiece to another location including performing steps of;

(a) positioning the SPM scanning probe at a sweep-start position in a region of the workpiece, the sweep-start position lying on a first reference line, the first reference line being one among a plurality of reference lines passing through a common point of origin in the region;

(b) adjusting the SPM scanning probe along the Z-direction to a first Z-direction position;

(c) moving a first portion of the deposit of debris in a direction substantially orthogonal to the first reference line by translating the SPM scanning probe in a direction substantially orthogonal to the first reference line on which the sweep-start position lies; and

(d) moving additional portions of the deposit of debris by repeating (a)-(c) using additional sweep-start positions along the first reference line and by adjusting the Z-direction position of the SPM scanning probe.

9. The computer-program product of claim 8 wherein the second first computer instructions which, when executed by the computerized controller, further cause the computerized controller to move still further additional portions of the deposit of debris in a direction substantially orthogonal to a second reference line by positioning the SPM scanning probe at a sweep-start position lying on the second reference line and performing (a)-(d) for the second reference line.