Semiconductor chip assembly with post/base heat spreader and vertical signal routing

• US 7,948,076 B2
• Filed: 09/11/2009
• Issued: 05/24/2011
• Est. Priority Date: 03/25/2008
• Status: Expired due to Fees

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W. C., Wang, Chia-Chung
• Primary Examiner(s): Parekh; Nitin
• Application Number:
  US12/557,541
• Publication Number:
  US 20100001395A1
• Time in Patent Office: 620 Days
• Field of Search: 257/707, 257/713, 257/784, 257/E23.101
• US Class Current: 257/707
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/112 : directly combined with via connections
• CPC Class Codes: H05K 2201/0352 : Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/09736 : Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10553 : Component over metal, i.e. metal plate in between bottom of component and surface of PCB
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 2203/0733 : Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
• CPC Class Codes: H05K 3/06 : the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/4652 : Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally and supports the substrate. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a pad, a routing line, a first via and a dielectric layer, wherein the pad extends above the dielectric layer, the routing line extends below the dielectric layer, the first via extends through the dielectric layer to the routing line, and an aperture extends through the substrate;

a second via that extends through the adhesive to the routing line; and

a terminal that extends below the adhesive;

wherein an electrically conductive path between the pad and the terminal includes the first via, the routing line and the second via;

wherein the semiconductor device is mounted on the heat spreader, overlaps or is overlapped by the post, is electrically connected to the pad and the terminal, and is thermally connected to the post and the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer and between the base and the substrate;

wherein the substrate is mounted on the adhesive and extends above the base, and the routing line is embedded in the adhesive; and

wherein the post extends through the opening into the aperture and above the dielectric layer, and the base extends below the adhesive and the substrate.

2. The assembly of claim 1, wherein the semiconductor device is a semiconductor chip that overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base.

3. The assembly of claim 2, wherein the chip is mounted on the heat spreader using a die attach, electrically connected to the pad using a wire bond and thermally connected to the post using the die attach.

4. The assembly of claim 2, wherein the adhesive contacts the post and the dielectric layer in the gap and contacts the base, the dielectric layer, the routing line, the second via and the terminal outside the gap.

5. The assembly of claim 2, wherein the adhesive covers and surrounds the post in the lateral directions.

6. The assembly of claim 2, wherein the adhesive fills the gap.

7. The assembly of claim 2, wherein the adhesive fills the space between the base and the substrate.

8. The assembly of claim 2, wherein the adhesive overlaps the terminal.

9. The assembly of claim 2, wherein the adhesive extends to peripheral edges of the assembly.

10. The assembly of claim 2, wherein the post is integral with the base.

11. The assembly of claim 2, wherein the post is coplanar with the adhesive above the dielectric layer.

12. The assembly of claim 2, wherein the post has a diameter that decreases as it extends upwardly from the base to its flat top.

13. The assembly of claim 2, wherein the base is coplanar with the terminal below the adhesive.

14. The assembly of claim 2, wherein the base covers the post in the downward direction, supports the substrate and is spaced from peripheral edges of the assembly.

15. The assembly of claim 2, wherein the substrate is spaced from the post and the base.

16. The assembly of claim 2, wherein the substrate is a laminated structure.

17. The assembly of claim 2, wherein the heat spreader includes a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that contacts and overlaps the adhesive.

18. The assembly of claim 17, wherein the post, the base and the cap include copper.

19. The assembly of claim 17, wherein the cap is coplanar with the pad above the dielectric layer.

20. The assembly of claim 17, wherein the cap has a rectangular or square shape and the top of the post has a circular shape.

21. A semiconductor chip assembly, comprising:

a semiconductor chip;

an adhesive that includes an opening;

a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

a substrate that includes first and second conductive layers, a first via and a dielectric layer, wherein the first conductive layer contacts and extends above the dielectric layer, the second conductive layer contacts and extends below the dielectric layer, a pad includes a selected portion of the first conductive layer and contacts and extends above the dielectric layer, a routing line includes a selected portion of the second conductive layer and contacts and extends below the dielectric layer, the first via contacts and extends through the dielectric layer between the first conductive layer and the routing line, and an aperture extends through the substrate;

a second via that contacts and extends through the adhesive to the routing line; and

a terminal that contacts and extends below the adhesive;

wherein an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via;

wherein the chip is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, is sandwiched between the base and substrate outside the gap, covers and surrounds the post in the lateral directions, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly;

wherein the substrate is mounted on the adhesive and extends above the base, and the second conductive layer is embedded in the adhesive; and

wherein the post extends through the opening into the aperture and above the dielectric layer, the cap contacts and overlaps the adhesive and the base extends below the chip, the adhesive and the substrate in the downward direction, covers the chip and the post in the downward direction and supports the substrate.

22. The assembly of claim 21, wherein the chip is mounted on the cap using a die attach, electrically connected to the pad using a wire bond and thermally connected to the cap using the die attach.

23. The assembly of claim 21, wherein the substrate is spaced from the post and the base, and the adhesive fills the gap and the space between the base and the substrate and is contained in the space between the heat spreader and the substrate.

24. The assembly of claim 21, wherein the post has a diameter that decreases as it extends upwardly from the base to the cap.

25. The assembly of claim 21, wherein the post is coplanar with the adhesive above the dielectric layer, the base is coplanar with the terminal below the adhesive, the cap is coplanar with the pad above the dielectric layer and the post, the base and the cap include copper.

26. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a pad, a routing line, a first via and a dielectric layer, wherein the pad extends above the dielectric layer, the routing line extends below the dielectric layer, the first via extends through the dielectric layer to the routing line, and an aperture extends through the substrate;

a second via that extends through the adhesive to the routing line; and

a terminal that extends below the adhesive;

wherein an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via;

wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, contacts the post and the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer and between the base and the substrate;

wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the routing line is embedded in the adhesive; and

wherein the post extends into the opening and the aperture, and the base extends below the adhesive and the substrate.

27. The assembly of claim 26, wherein the adhesive contacts the post and the dielectric layer in the gap, contacts the dielectric layer, the routing line, the second via and the terminal outside the gap and extends to peripheral edges of the assembly.

28. The assembly of claim 26, wherein the post is coplanar with the adhesive above the dielectric layer.

29. The assembly of claim 26, wherein the heat spreader includes a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and the cap contacts and overlaps the adhesive.

30. The assembly of claim 29, wherein the cap is coplanar with the pad above the the adhesive and the dielectric layer, the terminal is coplanar with the base below the adhesive and the dielectric layer and the post is copper, the base, the cap, the pad and the terminal consist of copper and a plated contact that provides a surface finish on the copper and the cap is copper where it is adjacent to the post.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a pad, a routing line, a first via and a dielectric layer, wherein the pad extends above the dielectric layer, the routing line extends below the dielectric layer, the first via extends through the dielectric layer to the routing line, and an aperture extends through the substrate;

a second via that extends through the adhesive to the routing line; and

a terminal that extends below the adhesive;

wherein an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via;

wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, and contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the substrate outside the gap;

wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the routing line is embedded in the adhesive; and

wherein the post extends into the opening and the aperture, and the base extends below the adhesive and the substrate.

32. The assembly of claim 31, wherein the adhesive contacts the routing line, the second via and the terminal and extends to peripheral edges of the assembly.

33. The assembly of claim 31, wherein the post is coplanar with the adhesive above the dielectric layer.

34. The assembly of claim 31, wherein the heat spreader includes a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and the cap contacts and overlaps the adhesive.

35. The assembly of claim 34, wherein the cap is coplanar with the pad above the dielectric layer, the terminal is coplanar with the base below the adhesive and the post is copper, the base, the cap, the pad and the terminal consist of copper and a plated contact that provides a surface finish on the copper and the cap is copper where it is adjacent to the post.