Sensor network incorporating stretchable silicon

• US 7,948,147 B2
• Filed: 02/19/2009
• Issued: 05/24/2011
• Est. Priority Date: 02/19/2009
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Carralero, Michael Alexander, Vian, John Lyle
• Primary Examiner(s): Budd; Mark
• Application Number:
  US12/389,196
• Publication Number:
  US 20100207487A1
• Time in Patent Office: 824 Days
• Field of Search: 310/328, 310330-332, 310/311, 310/339
• US Class Current: 310/311
• CPC Class Codes: B82B 3/0014 Array or network of similar nanostructural elements
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G01M 5/00 Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings G01M9/00 takes precedence
• CPC Class Codes: H01L 21/02603 Nanowires
• CPC Class Codes: H10N 30/00 Piezoelectric or electrostrictive devices integrated devices or assemblies of multiple devices H10N39/00
• CPC Class Codes: H10N 30/80 Constructional details
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base

Abstract

A sensor network is described which includes a stretchable silicon substrate, and a plurality of nodes fabricated on the stretchable silicon substrate. The nodes include at least one of an energy harvesting and storage element, a communication device, a sensing device, and a processor. The nodes are interconnected via interconnecting conductors formed in the substrate.

Claims

1. A sensor network comprising:

a stretchable silicon substrate; and

a plurality of nodes fabricated on said stretchable silicon substrate, said nodes comprising an energy harvesting and storage element comprising zinc oxide nanowires grown on said stretchable silicon substrate, and at least one of a communication device, a sensing device, and a processor, said nodes interconnected via interconnecting conductors formed in said substrate.

2. A sensor network according to claim 1 wherein said energy harvesting and storage elements are configured to provide power to said communication devices, said sensing devices, and said processor.

3. A sensor network according to claim 1 wherein said energy harvesting and storage elements comprise piezo-electric devices configured to convert mechanical stress into electrical energy.

4. A sensor network according to claim 1 wherein said stretchable silicon substrate comprises a plurality of conductors for interconnecting said nodes.

5. A sensor network according to claim 1 wherein a portion of said nodes comprise a wireless communication capability.

6. A sensor network according to claim 5 wherein the wireless communication capability comprises an RF transceiver.

7. A sensor network according to claim 1 wherein at least one of said nodes comprises processing capabilities for communicating with a system external to said sensor network.

8. A sensor network according to claim 7 wherein the communications with the external system are via a vehicle network interface.

9. A sensor network according to claim 1 wherein said sensing devices comprise at least one of a sensor for structural health monitoring and management, an ice accretion sensor, and a sensor configured for sensing dynamic flow separation of the air surrounding said sensor.

10. A sensor network according to claim 1 wherein said stretchable silicon substrate comprises a monolithic silicon die stretched over an area.

11. A sensor network according to claim 1 wherein said sensing devices comprises at least one of temperature sensors, pressure sensors, and vibration sensors.

12. A network for monitoring a structure, said network comprising:

a stretchable silicon substrate;

a plurality of sensors fabricated on said stretchable silicon substrate;

at least one communication device fabricated on said stretchable silicon substrate; and

at least one energy harvesting and storage element fabricated on said stretchable silicon substrate comprising zinc oxide nanowires grown on said stretchable silicon substrate, said stretchable silicon substrate comprising a plurality of conductive paths therein that interconnect said plurality of sensors, said at least one communication device, and said at least one energy harvesting and storage element, said network configured for attachment across a structure dispersing said sensors, data from said sensors communicated to an external device via said at least one communication device.

13. A network for monitoring a structure according to claim 12 further comprising at least one processor interconnected with said at least one energy harvesting and storage element, said at least one communication device, and said plurality of sensors, said at least one processor operable to communicate with a system external to said network.