Multilayered probe card

• US 7,948,252 B2
• Filed: 07/15/2008
• Issued: 05/24/2011
• Est. Priority Date: 07/11/2001
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Tseng, Chih-Chiang, Lotfizadeh, Poya, Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): ISLA RODAS, RICHARD
• Application Number:
  US12/173,695
• Publication Number:
  US 20080272794A1
• Time in Patent Office: 1,043 Days
• Field of Search: 324754-765, 324/158.1
• US Class Current: 324/754.07
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 29/49453 Pulley making

Abstract

A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Claims

1. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:

a wiring substrate including a plurality of first electrical contacts;

a composite wiring structure comprising a first portion and a second portion, wherein;

the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on a first surface of the substrate,

the second portion comprises an insulating material disposed on and integrally joined to the first surface of the substrate, a plurality of third electrical contacts disposed in a second pattern on an outer surface of the insulating material, and a plurality of electrical connections electrically connecting the third electrical contacts through the insulating material to the second electrical contacts, the second pattern at the outer surface of the insulating material being different than the first pattern at the first surface of the substrate,

a plurality of resilient, electrically conductive probes disposed at the outer surface of the insulating material and electrically connected to ones of the third electrical contacts, and

ones of the second electrical contacts are electrically connected through the substrate to ones of the first electrical contacts.

2. The probe card assembly of claim 1, wherein the composite wiring structure further comprises an electronic component electrically connected to ones of the third contacts.

3. The probe card assembly of claim 2, wherein the electronic component is one of a capacitor or a resistor.

4. The probe card assembly of claim 1, wherein the second pattern corresponds to a pattern of contact points on electronic devices to be tested.

5. The probe card assembly of claim 4, wherein the first pattern matches a pattern of the first electrical contacts in a manner that allows the second electrical contacts to align with the first electrical contacts.

6. The probe card assembly of claim 1, wherein the first portion comprises a semi-standard, prefabricated ceramic substrate.

7. The probe card assembly of claim 1, wherein the first portion further comprises a power planelet and a ground planelet.

8. The probe card assembly of claim 7, wherein the power planelet and the ground planelet each define holes through which electrically conductive vias connected to ones of the first contacts pass without being electrically connected to the power planelet or the ground planelet.

9. The probe card assembly of claim 1, wherein the first portion comprises a ceramic substrate whose design and manufacture is independent from a design of the semiconductor die to be tested.

10. The probe card assembly of claim 1, wherein the outer surface of the insulating material is opposite a joined surface of said insulating material that is integrally joined to the first surface of the substrate.

11. The probe card assembly of claim 10, wherein each of ones of the electrical connections comprises an electrically conductive via through said insulating material from the joined surface to the outer surface and an electrically conductive trace on the outer surface of the insulating material from the via to one of the third contacts.

12. The probe card assembly of claim 11, wherein each of ones of the probes are attached to one of the third contacts.

13. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:

a wiring substrate including a plurality of first electrical contacts;

a composite wiring structure comprising a first portion and a second portion, the second portion being integrally joined to a first surface of the first portion, wherein;

the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on the first surface of the substrate,

the second portion comprises an insulating material, a plurality of third electrical contacts disposed in a second pattern, and a plurality of electrical connections electrically connecting the third electrical contacts to the second electrical contacts, the second pattern being different than the first pattern,

a plurality of resilient, electrically conductive are probes disposed on ones of the third electrical contacts, and

ones of the second contacts are physically and electrically connected to ones of the first electrical contacts, wherein;

the insulating material is disposed on the second electrical contacts, and

the third electrical contacts are disposed on the insulating material.

14. The probe card assembly of claim 13, wherein the electrical connections comprise electrically conductive vias through the insulating material to the second contacts and electrically conductive traces disposed on the insulating material connecting ones of the vias with ones of the third contacts.

15. The probe card assembly of claim 14, wherein the insulating material comprises polyimid.

16. The probe card assembly of claim 13, wherein the composite wiring structure further comprises an electronic component electrically connected to ones of the third contacts.

17. The probe card assembly of claim 16, wherein the electronic component is one of a capacitor or a resistor.

18. The probe card assembly of claim 13, wherein the second pattern corresponds to a pattern of contact points on electronic devices to be tested.

19. The probe card assembly of claim 18, wherein the first pattern matches a pattern of the first electrical contacts in a manner that allows the second electrical contacts to align with the first electrical contacts.

20. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:

a wiring substrate including a plurality of first electrical contacts;

a composite wiring structure comprising a first portion and a second portion, the second portion being integrally joined to a first surface of the first portion, wherein;

the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on the first surface of the substrate,

the second portion comprises an insulating material, a plurality of third electrical contacts disposed in a second pattern, and a plurality of electrical connections electrically connecting the third electrical contacts to the second electrical contacts, the second pattern being different than the first pattern,

a plurality of resilient, electrically conductive are probes disposed on ones of the third electrical contacts, and

ones of the second electrical contacts are physically and electrically connected to ones of the first electrical contacts,

wherein the first portion further comprises a power planelet and a ground planelet, and

wherein the power planelet and the ground planelet each define a hole through which a via passes without being electrically connected to the power planelet or the ground planelet.

21. The probe card assembly of claim 20, wherein the composite wiring structure further comprises an electronic component electrically connected to ones of the third contacts.

22. The probe card assembly of claim 21, wherein the electronic component is one of a capacitor or a resistor.

23. The probe card assembly of claim 20, wherein the second pattern corresponds to a pattern of contact points on electronic devices to be tested.

24. The probe card assembly of claim 23, wherein the first pattern matches a pattern of the first electrical contacts in a manner that allows the second electrical contacts to align with the first electrical contacts.