Multilayered probe card
First Claim
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1. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:
- a wiring substrate including a plurality of first electrical contacts;
a composite wiring structure comprising a first portion and a second portion, wherein;
the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on a first surface of the substrate,the second portion comprises an insulating material disposed on and integrally joined to the first surface of the substrate, a plurality of third electrical contacts disposed in a second pattern on an outer surface of the insulating material, and a plurality of electrical connections electrically connecting the third electrical contacts through the insulating material to the second electrical contacts, the second pattern at the outer surface of the insulating material being different than the first pattern at the first surface of the substrate,a plurality of resilient, electrically conductive probes disposed at the outer surface of the insulating material and electrically connected to ones of the third electrical contacts, andones of the second electrical contacts are electrically connected through the substrate to ones of the first electrical contacts.
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Accused Products
Abstract
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
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Citations
24 Claims
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1. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:
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a wiring substrate including a plurality of first electrical contacts; a composite wiring structure comprising a first portion and a second portion, wherein; the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on a first surface of the substrate, the second portion comprises an insulating material disposed on and integrally joined to the first surface of the substrate, a plurality of third electrical contacts disposed in a second pattern on an outer surface of the insulating material, and a plurality of electrical connections electrically connecting the third electrical contacts through the insulating material to the second electrical contacts, the second pattern at the outer surface of the insulating material being different than the first pattern at the first surface of the substrate, a plurality of resilient, electrically conductive probes disposed at the outer surface of the insulating material and electrically connected to ones of the third electrical contacts, and ones of the second electrical contacts are electrically connected through the substrate to ones of the first electrical contacts. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:
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a wiring substrate including a plurality of first electrical contacts; a composite wiring structure comprising a first portion and a second portion, the second portion being integrally joined to a first surface of the first portion, wherein; the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on the first surface of the substrate, the second portion comprises an insulating material, a plurality of third electrical contacts disposed in a second pattern, and a plurality of electrical connections electrically connecting the third electrical contacts to the second electrical contacts, the second pattern being different than the first pattern, a plurality of resilient, electrically conductive are probes disposed on ones of the third electrical contacts, and ones of the second contacts are physically and electrically connected to ones of the first electrical contacts, wherein; the insulating material is disposed on the second electrical contacts, and the third electrical contacts are disposed on the insulating material. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A probe card assembly for testing semiconductor dies, the probe card assembly comprising:
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a wiring substrate including a plurality of first electrical contacts; a composite wiring structure comprising a first portion and a second portion, the second portion being integrally joined to a first surface of the first portion, wherein; the first portion comprises a substrate and a plurality of second electrical contacts disposed in a first pattern on the first surface of the substrate, the second portion comprises an insulating material, a plurality of third electrical contacts disposed in a second pattern, and a plurality of electrical connections electrically connecting the third electrical contacts to the second electrical contacts, the second pattern being different than the first pattern, a plurality of resilient, electrically conductive are probes disposed on ones of the third electrical contacts, and ones of the second electrical contacts are physically and electrically connected to ones of the first electrical contacts, wherein the first portion further comprises a power planelet and a ground planelet, and wherein the power planelet and the ground planelet each define a hole through which a via passes without being electrically connected to the power planelet or the ground planelet. - View Dependent Claims (21, 22, 23, 24)
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Specification