Circuit board unit and method for production thereof
First Claim
1. A circuit board unit comprising:
- a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that an estimated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board topmost laminate;
an electrically insulating laminate arranged under the circuit board topmost laminate;
inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipated;
a cooling plate arranged below the electrically insulating laminate and the inserts, the cooling plate having a plurality of cooling passageways for circulating a liquid coolant through the cooling plate; and
one or more plated through holes defined in the circuit board topmost laminate for transporting the high heat dissipated from the upper side to the underside of the topmost laminate, the one or more plated through holes located below surface-mountable devices with high heat dissipation, said plated through holes being adapted in number and design to an estimated heat dissipated of each surface-mountable device.
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Accused Products
Abstract
The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.
56 Citations
17 Claims
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1. A circuit board unit comprising:
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a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that an estimated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board topmost laminate; an electrically insulating laminate arranged under the circuit board topmost laminate; inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipated; a cooling plate arranged below the electrically insulating laminate and the inserts, the cooling plate having a plurality of cooling passageways for circulating a liquid coolant through the cooling plate; and one or more plated through holes defined in the circuit board topmost laminate for transporting the high heat dissipated from the upper side to the underside of the topmost laminate, the one or more plated through holes located below surface-mountable devices with high heat dissipation, said plated through holes being adapted in number and design to an estimated heat dissipated of each surface-mountable device. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A circuit board module comprising:
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two circuit board units, each including a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that heat dissipated by the surface-mountable devices is transported from the upper side to an underside of the circuit board topmost laminate; an electrically insulating laminate arranged under the circuit board topmost laminate; inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below the surface-mountable devices with high heat dissipated; a cooling plate arranged below the electrically insulating laminate and the inserts, the cooling plate having a plurality of cooling passageways for circulating a liquid coolant through the cooling plate; and one or more plated through holes defined in the topmost laminate for transporting the heat from the upper side to the underside of the topmost laminate, the one or more plated through holes located below the surface-mountable devices with the high heat dissipation, the one or more plated through holes being adapted in number to the heat dissipated from each of the surface-mountable devices; wherein the two circuit board units and additional sidewalls form the circuit board module, the circuit board units are directly electrically interconnected by surface-mountable device connectors and the electrical inputs and outputs are ported through the sidewalls by hermetically sealed electrical connections. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification