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Vapor deposition of a layer

  • US 7,951,421 B2
  • Filed: 04/20/2006
  • Issued: 05/31/2011
  • Est. Priority Date: 04/20/2006
  • Status: Active Grant
First Claim
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1. A method of depositing a layer onto a substrate, comprising:

  • heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited;

    dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized;

    providing an area vapor dispenser having a plurality of apertures; and

    directing the evaporized evaporant from the evaporator to the area vapor dispenser so that the vaporant is dispensed through the apertures to deposit the layer on the substrate area;

    wherein one or more shields are added under the area vapor dispenser and above the substrate to cool the evaporant, and the one or more shields have a plurality of cooling elements formed inside thereof.

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