Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a thermal post, a signal post, a base, an adhesive and a conductive layer, whereinthe thermal post is adjacent to the base, extends above the base in an upward direction, extends into a first opening in the adhesive and is aligned with a first aperture in the conductive layer,the signal post is adjacent to the base, extends above the base in the upward direction, extends into a second opening in the adhesive and is aligned with a second aperture in the conductive layer,the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions,the adhesive is mounted on and extends above the base, is sandwiched between the base and the conductive layer and is non-solidified, andthe conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer;
solidifying the adhesive;
thenproviding a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer;
mounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes the signal post; and
thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base.
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Abstract
A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
50 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post, a base, an adhesive and a conductive layer, wherein the thermal post is adjacent to the base, extends above the base in an upward direction, extends into a first opening in the adhesive and is aligned with a first aperture in the conductive layer, the signal post is adjacent to the base, extends above the base in the upward direction, extends into a second opening in the adhesive and is aligned with a second aperture in the conductive layer, the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, is sandwiched between the base and the conductive layer and is non-solidified, and the conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer; solidifying the adhesive;
thenproviding a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer; mounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes the signal post; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the signal post is adjacent to and integral with the base and extends above the base in the upward direction, and the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein first and second openings extend through the adhesive; providing a conductive layer, wherein first and second apertures extend through the conductive layer; mounting the adhesive on the base, including inserting the thermal post into the first opening and the signal post into the second opening, wherein the adhesive extends above the base, the thermal post extends into the first opening and the signal post extends into the second opening; mounting the conductive layer on the adhesive, including aligning the thermal post with the first aperture and the signal post with the second aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the thermal post upward in the first aperture, moving the signal post upward in the second aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the posts and the base to the conductive layer;
thenproviding a conductive trace that includes a pad, a terminal, a routing line and the signal post, wherein the conductive trace includes a selected portion of the conductive layer and an electrically conductive path between the pad and the terminal includes the routing line and the signal post; mounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the signal post is adjacent to and integral with the base and extends above the base in the upward direction, and the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein first and second openings extend through the adhesive; providing a conductive layer, wherein first and second apertures extend through the conductive layer; mounting the adhesive on the base, including inserting the thermal post through the first opening and the signal post through the second opening, wherein the adhesive extends above the base, the thermal post extends through the first opening and the signal post through the second opening; mounting the conductive layer alone on the adhesive, including inserting the thermal post into the first aperture and the signal post into the second aperture, wherein the conductive layer extends above the adhesive, the thermal post extends through the first opening into the first aperture, the signal post extends through the second opening into the second aperture, the adhesive is sandwiched between the base and the conductive layer and is non-solidified, a first gap is located in the first aperture between the thermal post and the conductive layer and a second gap is located in the second aperture between the signal post and the conductive layer;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the thermal post upward in the first aperture, moving the signal post upward in the second aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in the gaps; applying heat to solidify the molten adhesive, thereby mechanically attaching the posts and the base to the conductive layer;
thenproviding a conductive trace that includes a pad, a terminal, a routing line and the signal post, including removing selected portions of the conductive layer using a first etch mask that defines the pad and the routing line and removing selected portions of the base using a second etch mask that defines the terminal, wherein the pad and the routing line include selected portions of the conductive layer, the terminal includes an unetched portion of the base that is adjacent to the signal post and is spaced and separated from and no longer part of the base, and an electrically conductive path between the pad and the terminal includes the routing line and the signal post;
thenmounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (22, 23, 24, 25)
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26. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post, a base, an adhesive and a substrate, wherein the substrate includes a conductive layer and a dielectric layer, the thermal post is adjacent to the base, extends above the base in an upward direction, extends through a first opening in the adhesive and extends into a first aperture in the substrate, the signal post is adjacent to the base, extends above the base in the upward direction, extends through a second opening in the adhesive and extends into a second aperture in the substrate, the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified, the substrate is mounted on and extends above the adhesive, and the conductive layer extends above the dielectric layer, a first gap is located in the first aperture between the thermal post and the substrate, and a second gap is located in the second aperture between the signal post and the substrate;
thenflowing the adhesive into and upward in the gaps; solidifying the adhesive;
thenmounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post, a conductive trace includes a pad, a terminal, the signal post and a selected portion of the conductive layer and an electrically conductive path between the pad and the terminal includes the signal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the signal post is adjacent to and integral with the base and extends above the base in the upward direction, and the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein first and second openings extend through the adhesive; providing a substrate that includes a conductive layer and a dielectric layer, wherein first and second apertures extend through the substrate; mounting the adhesive on the base, including inserting the thermal post through the first opening and the signal post through the second opening, wherein the adhesive extends above the base, the thermal post extends through the first opening and the signal post extends through the second opening; mounting the substrate on the adhesive, including inserting the thermal post into the first aperture and the signal post into the second aperture, wherein the substrate extends above the adhesive, the conductive layer extends above the dielectric layer, the thermal post extends through the first opening into the first aperture, the signal post extends through the second opening into the second aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, a first gap is located in the first aperture between the thermal post and the substrate and a second gap is located in the second aperture between the signal post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the thermal post upward in the first aperture, moving the signal post upward in the second aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gaps and the posts and the molten adhesive extend above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the posts and the base to the substrate;
thenmounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post, a conductive trace includes a pad, a terminal, the signal post and a selected portion of the conductive layer and an electrically conductive path between the pad and the terminal includes the signal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the signal post is adjacent to and integral with the base and extends above the base in the upward direction, and the base extends below the posts in a downward direction opposite the upward direction and extends laterally from the posts in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein first and second openings extend through the adhesive; providing a substrate that includes a first conductive layer and a dielectric layer, wherein first and second apertures extend through the substrate; mounting the adhesive on the base, including inserting the thermal post through the first opening and the signal post through the second opening, wherein the adhesive extends above the base, the thermal post extends through the first opening and the signal post extends through the second opening; mounting the substrate on the adhesive, including inserting the thermal post into the first aperture and the signal post into the second aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer, the thermal post extends through the first opening into the first aperture, the signal post extends through the second opening into the second aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, a first gap is located in the first aperture between the thermal post and the substrate and a second gap is located in the second aperture between the signal post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the thermal post upward in the first aperture, moving the signal post upward in the second aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gaps and the posts and the molten adhesive extend above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the posts and the base to the substrate;
thendepositing a second conductive layer on the posts, the adhesive and the first conductive layer; providing a conductive trace that includes a pad, a terminal and the signal post, including removing selected portions of the conductive layers using a first etch mask that defines the pad and removing selected portions of the base using a second etch mask that defines the terminal, wherein the pad includes selected portions of the conductive layers, the terminal includes an unetched portion of the base that is adjacent to the signal post and is spaced and separated from and no longer part of the base, and an electrically conductive path between the pad and the terminal includes the signal post; providing a cap on the thermal post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer using the first etch mask, wherein the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post;
thenmounting a semiconductor device on the cap, wherein a heat spreader includes the thermal post, the base and the cap and the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (47, 48, 49, 50)
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Specification