Coated package with filter profile

• US 7,951,863 B2
• Filed: 05/07/2007
• Issued: 05/31/2011
• Est. Priority Date: 07/28/2004
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Keh, Kean Loo, Oon, Chin Hin, Tan, Boon Keat
• Primary Examiner(s): Figueroa; John J
• Application Number:
  US11/744,955
• Publication Number:
  US 20080105939A1
• Time in Patent Office: 1,485 Days
• Field of Search: None
• US Class Current: 524/394
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/1443 with at least one potential jump or surface barrier
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31515 As intermediate layer

Abstract

Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.

Claims

1. An integrated circuit color sensor package, comprising:

an integrated circuit die comprising a color sensor photodetector and a first light filter disposed over the photodetector, the color sensor photodetector being incorporated into and forming a portion of the integrated circuit die, the first light filter being a photosensitive organic color filter;

a substrate upon which the integrated circuit is mounted;

wherein at least portions of the first light filter, the integrated circuit die and the substrate are encapsulated by a light transmissive epoxy encapsulant comprising an upper surface; and

a coating disposed over at least portions of the upper surface and above the first light filter, the coating being configured to form a second light filter.

2. The package of claim 1, wherein the second light filter is an interference filter.

3. The package of claim 2, wherein the interference filter includes an infrared (IR) block filter.

4. The package of claim 2, wherein the package is configured for high volume manufacturing;

and wherein the second light filter is formed directly on a plurality of encapsulated packages in high density form.