×

Semiconductor device with hollow structure

  • US 7,952,185 B2
  • Filed: 12/22/2006
  • Issued: 05/31/2011
  • Est. Priority Date: 12/08/2006
  • Status: Active Grant
First Claim
Patent Images

1. A device, comprising:

  • a chip, which is held in a casting compound and on which a hollow structure is arranged, the casting compound and the hollow structure each forming part of a surface of the device which extends substantially in parallel to a principal plane of the chip;

    a dielectric layer,a first electrically conductive layer overlying at least a part of a surface formed by the casting compound and a part of a surface being formed by the hollow structure, wherein the first electrically conductive layer is arranged between the chip and the dielectric layer, andwherein the hollow structure is arranged between the chip and a portion of the first electrically conductive layer in relation to a direction normal to the principal plane.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×