Stacked packages with bridging traces

• US 7,952,195 B2
• Filed: 12/28/2006
• Issued: 05/31/2011
• Est. Priority Date: 12/28/2006
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Haba, Belgacem
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US11/648,172
• Publication Number:
  US 20080157323A1
• Time in Patent Office: 1,615 Days
• Field of Search: None
• US Class Current: 257/724
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05009 Bonding area integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16146 the bump connector connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 23/481 : Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 : Gold [Au]

Abstract

A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectronic element so as to form a stacked package. A bridging element electrically connects the first microelectronic element and the second microelectronic element. The first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element.

Claims

1. A microelectronic assembly comprising:

a first microelectronic element having a front surface, first contacts exposed at the front surface, a rear surface opposite the front surface, and a first edge surface extending between the front and rear surfaces;

a second microelectronic element having a front surface, second contacts exposed at such front surface, a rear surface opposite such front surface, and a second edge surface extending between the front and rear surfaces, the first and second microelectronic elements attached to one another with the rear surfaces of the first and second microelectronic elements facing one another;

a layer extending between the rear surfaces of the first and second microelectronic elements;

at least one bridging element extending between at least one of the first contacts and at least one of the second contacts so as to electrically connect the two, wherein the at least one first contact and the at least one second contact remain exposed for electrically connecting the microelectronic assembly to a substrate external to the microelectronic assembly,

the at least one bridging element extending as a continuous trace along the first and second edge surfaces and along a surface of the layer between the rear surfaces of the first and second microelectronic elements, wherein the layer provides electrical isolation between the at least one bridging element and the bodies of the microelectronic elements.

2. The microelectronic assembly of claim 1, further comprising a plurality of traces exposed on the respective front surfaces of the first microelectronic element and second microelectronic element, at least some of the plurality of traces extending from at least some of the first contacts to the at least one bridging element and at least some of the plurality of traces extending from at least some of the second contacts to the at least one bridging element.

3. The microelectronic assembly of claim 2, wherein the layer includes an adhesive bonding the rear surfaces of the first and second microelectronic elements to one another.

4. The microelectronic assembly of claim 1, further comprising a third microelectronic element having a front face and a rear face, and

a fourth microelectronic element having a rear face,

wherein the third and fourth microelectronic elements are attached such that the rear face of the third microelectronic element faces toward the rear face of the fourth microelectronic element,

the third microelectronic element also being attached to the first and second microelectronic elements such that the front face of the third microelectronic element faces toward the front surface of the second microelectronic element.

5. The microelectronic assembly of claim 1, further comprising masses of conductive material disposed on the plurality of contacts, the conductive material masses enabling electrical connection to the substrate.

6. The microelectronic assembly of claim 1, wherein the bridging elements further include traces extending from the plurality of contacts along the front surfaces of the first and second microelectronic elements.

7. The microelectronic assembly of claim 1, wherein the surface of the layer is arranged in at least substantial alignment with the first and second edge surfaces.

8. A microelectronic assembly comprising:

a first microelectronic element having a front surface, first contacts exposed at the front surface, a rear surface opposite the front surface, and a first edge surface extending between the front and rear surfaces;

a second microelectronic element having a front surface, second contacts exposed at such front surface, a rear surface opposite such front surface, and a second edge surface extending between the front and rear surfaces, the first and second microelectronic elements attached to one another with the rear surfaces of the first and second microelectronic elements facing one another;

an adhesive layer bonding the rear surfaces of the first and second microelectronic elements and having an edge surface arranged in at least substantial alignment with the edge surfaces of the first and second microelectronic elements;

at least one bridging element extending between at least one of the first contacts and at least one of the second contacts so as to electrically connect the two, wherein the at least one first contact and the at least one second contact remain exposed for electrically connecting the microelectronic assembly to a substrate external to the microelectronic assembly, the at least one bridging element extending as a continuous trace along the first and second edge surfaces and along a surface of the adhesive layer between the rear surfaces of the first and second microelectronic elements.