Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

• US 7,952,373 B2
• Filed: 10/23/2006
• Issued: 05/31/2011
• Est. Priority Date: 05/23/2000
• Status: Expired due to Fees

• Current Assignee: Advantest Corporation
• Original Assignee: Verigy Limited (Advantest Corporation)
• Inventors: Mok, Sammy, Chong, Fu Chiung
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Nguyen; Trung Q
• Application Number:
  US11/552,110
• Publication Number:
  US 20070046304A1
• Time in Patent Office: 1,681 Days
• Field of Search: 324750-755, 324/158.1, 324/690, 324/696, 324/767
• US Class Current: 324/754.14
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07364 with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Interleaved spring probe tip designs are defined which allow multiple probe contacts on very small integrated circuit pads. The shapes of probe tips are preferably defined to control the depth of probe tip penetration between a probe spring and a pad or trace on an integrated circuit device. Improved protective coating techniques for spring probes are also disclosed, offering increased reliability and extended useful service lives for probe card assemblies.

Claims

1. A tile array, comprising:

a tiling substrate having a width and a length and having a probe surface and a connector surface;

at least one probe contact area located on said probe surface of said tiling substrate, each of said probe contact areas having a plurality of electrically conductive spring probes, wherein the at least one probe contact area is comprised of a plurality of contact regions aligned along said width and said length of said probe surface; and

a plurality of electrical connections extending through said tiling substrate between each of said plurality of said spring probe contact tips and said connector surface.

2. The tile array of claim 1, wherein each of said plurality of electrically conductive spring probes on said probe surface of said tiling substrate are photolithographically patterned springs.

3. The tile array of claim 1, wherein said plurality of electrical connections extending through said tiling substrate between each of said plurality of said spring probe contact tips and said connector surface are metalized vias.

4. The tile array of claim 1, wherein said tiling substrate further comprises at least one insulated reference plane.

5. The tile array of claim 1, wherein said tiling substrate has a low thermal coefficient of expansion.

6. The tile array of claim 1, wherein said at least one probe contact area is aligned along said probe surface.

7. A tile array comprising

a tiling substrate having a width and a length and having a probe surface and a connector surface;

at least one probe contact area located on said probe surface of said tiling substrate, each of said probe contact areas having a plurality of electrically conductive spring probes;

a plurality of electrical connections extending through said tiling substrate between each of said plurality of said spring probe contact tips and said connector surface; and

a plurality of ball grid array solder connections on said connector surface of said tiling substrate, each of said ball grid array solder connections connected to each of said plurality of electrical connections on said connector surface of said tiling substrate.

8. A tiled probe assembly for connection to at least one integrated circuit device on a wafer, comprising:

a plurality of tiling substrates having a width and a length, each having a probe surface and a connector surface;

a plurality of probe contact areas located on said probe surface of each of said plurality of tiling substrates, each of said probe contact areas having a plurality of electrically conductive spring probes;

a plurality of electrical connections extending through each of said substrates between each of said plurality of said electrically conductive spring probes and said connector surface; and

a probe card substrate having a first surface and a second surface and a plurality of electrically conductive vias between said first surface and said second surface;

whereby each of said plurality of tiling substrates are positioned on said first surface of said probe card substrate, and whereby each said plurality of electrical connections are connected to each of said plurality of electrically conductive vias.

9. The tiled probe assembly of claim 8, wherein said probe card substrate is comprised of a material having a similar thermal coefficient of expansion to said wafer.

10. The tiled probe assembly of claim 8, wherein each of said plurality of tiling substrates provides a plurality of electrical connections to a single of said least one integrated circuit device through said plurality of electrically conductive spring probes.

11. The tiled probe assembly of claim 8, wherein each of said plurality of tiling substrates provides a plurality of electrical connections to a plurality of said integrated circuit devices through said plurality of electrically conductive spring probes.

12. The tiled probe assembly of claim 8, wherein said plurality of tiling substrates provides a plurality of electrical connections to said at least one integrated circuit device through said plurality of electrically conductive spring probes.

13. The tiled probe assembly of claim 8, wherein each of said plurality of tiling substrates has a low thermal coefficient of expansion.

14. The tiled probe assembly of claim 8, wherein each of said probe contact areas for each of said plurality of tiling substrates is aligned along said length of each of said probe surfaces.

15. The tiled probe assembly of claim 8, further comprising:

a plurality of ball grid array solder connections on said connector surface of each of said plurality of tiling substrates, in which each of said ball grid array solder connections is connected to each of said plurality of electrical connections.

16. The tiled probe assembly of claim 8, wherein each of said plurality of probe contact areas is comprised of a plurality of contact regions aligned along said probe surface.