Stacking structure of printed circuit board

• US 7,952,889 B2
• Filed: 06/05/2008
• Issued: 05/31/2011
• Est. Priority Date: 11/28/2007
• Status: Expired due to Fees

• Current Assignee: Chi Mei Communication Systems Incorporated (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Chi Mei Communication Systems Incorporated (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Chao, Yuan-Hsiao
• Primary Examiner(s): Levi; Dameon E
• Application Number:
  US12/133,477
• Publication Number:
  US 20090135576A1
• Time in Patent Office: 1,090 Days
• Field of Search: 361/816, 361/818, 361/800, 361/753, 361/799, 174/350, 174/377
• US Class Current: 361/816
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids

Abstract

A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.

Claims

1. A stacking structure of printed circuit board comprising:

a first printed circuit board having a first shielding frame arranged thereon;

a second shielding frame fit over the first shielding frame;

a second printed circuit board being mounted to the second shielding frame, the first printed circuit board and the second printed circuit board sandwiching the first shielding frame and the second shielding frame therebetween; and

at least one electronic component being disposed between the first and the second printed circuit board, and the first shielding frame detachably latched with the second shielding frame for shielding the at least one electronic element.

2. The stacking structure of printed circuit board as claimed in claim 1, wherein the first shielding frame comprises a first flange with a plurality of through holes, the second shielding frame comprises a second flange and wherein the second flange comprises a plurality of projections configured to be received in the through holes of the first shielding frame.

3. The stacking structure of printed circuit board as claimed in claim 2, wherein the second flange comprises a plurality of slits dividing the second flange into a plurality of sections.

4. The stacking structure of printed circuit board as claimed in claim 2, wherein the through holes are circular-shaped.

5. The stacking structure of printed circuit board as claimed in claim 2, wherein the first shielding frame further comprises a first extending portion extending from a top of the first flange toward internal space of the first shielding frame.

6. The stacking structure of printed circuit board as claimed in claim 2, wherein the second shielding frame further comprises a second extending portion extending from top of the second flange toward internal space of the second shielding frame for attaching the second shielding frame to the second printed circuit board.

7. The stacking structure of printed circuit board as claimed in claim 2, wherein the second printed circuit board comprises a first surface facing the first printed circuit board and a second surface opposite to the first surface, the second surface is configured for disposing electronic elements.

8. The stacking structure of printed circuit board as claimed in claim 7, wherein the stacking structure further comprises a cover mechanism for shielding the electronic elements disposed on the second surface of the second printed circuit board.

9. The stacking structure of printed circuit board as claimed in claim 8, wherein the cover mechanism comprises a shielding frame and a cover frame.

10. The stacking structure of printed circuit board as claimed in claim 9, wherein the shielding frame comprises a first flange with a plurality of through holes and a first extending portion extending from a top of the flange toward internal space of the shielding frame.

11. The stacking structure of printed circuit board as claimed in claim 10, wherein the cover frame comprises a second flange with a plurality of projections and a second extending portion extending from a top of the second flange toward internal space of the shielding frame so as to form a plate-like cover, and the plurality of projections are configured to be received in the through holes of the shielding frame.

12. The stacking structure of printed circuit board as claimed in claim 1, wherein the first shielding frame and the second shielding frame are made of metallic materials.

13. The stacking structure of printed circuit board as claimed in claim 1, wherein the first shielding frame and the second shielding frame are respectively formed on the first printed circuit board and the second printed circuit board via the surface mount technology technique.

14. A stacking structure of printed circuit board comprising:

a first printed circuit board;

a first shielding frame attached on the first printed circuit board;

a second shielding frame being on the first shielding frame and being latched to the first shielding frame;

a second printed circuit board being above the second shielding frame, the first shielding frame and the first printed circuit board; and

at least one electronic component being disposed between the first and the second printed circuit board, and the first shielding frame and the second shielding frame together shielding the at least one electronic element therebetween.