Surface mount (SMT) crimp terminal and method of securing wire to same

• US 7,955,147 B1
• Filed: 03/15/2010
• Issued: 06/07/2011
• Est. Priority Date: 03/15/2010
• Status: Active Grant

• Current Assignee: Zierick Manufacturing Corporation
• Original Assignee: Zierick Manufacturing Corporation
• Inventors: Legrady, Janos, Tarulli, Raffaele
• Primary Examiner(s): HYEON, HAE M
• Application Number:
  US12/723,758
• Time in Patent Office: 449 Days
• Field of Search: 439/877, 439/878, 439/881, 439/888, 439/83
• US Class Current: 439/877
• CPC Class Codes: H01R 12/515 Terminal blocks providing connections to wires or cables
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 4/20 using a crimping sleeve H01R4/01 takes precedence

Abstract

An surface mount technology (“SMT”) crimp terminal for mounting on printed circuit boards is in the form of a seamless circular tube or cylinder. The method of use includes depositing the SMT crimp terminal on a copper pad or land on a printed circuit board (“PCB”) coated with solder paste to render the pad or land tacky. The solder is reflowed by application of heat and the crimp terminal is soldered to the PCB. A bare wire to be retained is inserted through one end of the tube and the tube is subjected to sufficiently high stress, intermediate its axial ends, to induce plastic flow on the surface of the material. The force plastically deforms the central region of the tube as well as the bare wire received therein. Any form of mechanical hydraulic press can be used for this purpose and resulting deformation of the crimp terminal and the wire contained therein provides a retention force on the wire which is greater than wire breaking strength.

Claims

1. A surface mount crimp terminal comprising an electrically conductive seamless surface mounting cylindrical crimp tube having an exterior surface for soldering to a land or pad of a printed circuit board (PCB) and defining an axis and an internal longitudinal channel forming openings at both axial ends of said crimp tube, said internal channel having a diameter “

d”

dimensioned to receive a bare wire having a diameter equal to d−

Δ

, where Δ

is a decrement in the diameter of the bare wire from said diameter “

d”

that is within the range of 0.0001-0.010 inches.

2. The surface mount crimp terminal as defined in claim 1, wherein said crimp tube and exterior surface are formed of brass.

3. The surface mount crimp terminal as defined in claim 1, wherein said crimp tube is to be crimped along a predetermined axial length and said crimp tube has an axial length greater than said predetermined length.

4. The surface mount crimp terminal as defined in claim 1, wherein said crimp tube has an outer diameter approximately equal to twice said diameter “

d”

.

5. The surface mount crimp terminal as defined in claim 1, wherein said crimp tube develops a retention force in excess of 100 pounds force when crimped along an axial length in excess of 0.030 inches.

6. The surface mount crimp terminal as defined in claim 5, wherein said retention force is in excess of 200 pounds force.

7. A surface mount crimp terminal comprising an electrically conductive seamless surface mounting cylindrical crimp tube having an exterior surface for soldering to a land or pad of a printed circuit board (PCB) and defining an axis and an internal longitudinal channel forming opening at both axial ends of said crimp tube, said internal channel having a diameter “

d”

, at least one axial end being provided with an internal countersink or chamfer to facilitate insertion of a bare wire into said internal channel for wire diameters approaching “

d”

.

8. The surface mount crimp terminal as defined in claim 7, wherein said internal countersink or chamfer is provided at each axial end.

9. The surface mount crimp terminal as defined in claim 7, wherein an angle α

defined by said chamfer is selected to be within the range of 40°

-100°

.

10. The surface mount crimp terminal as defined in claim 9, wherein α

is 70°

.

11. A method of securing a wire to a printed circuit board (PCB) pad or land comprising the steps of:

applying a tacky solder paste on a pad or land on the PCB;

positioning a seamless cylindrical crimp tube, defining an axis and an internal longitudinal channel forming openings at both axial ends of said crimp tube and an internal diameter “

d”

, on the pad or land with the axis of said crimp tube parallel to said pad or land to contact said tacky paste;

heating said PCB and said crimp tube to reflow the solder to solder said crimp tube to said PCB;

inserting a bare wire within a channel extending through said crimp tube to extend the wire throughout the axial length of said channel; and

applying a compression force on said crimp tube in a direction substantially normal to said PCB to crimp said tube within a central region between said axial ends of said crimp tube.