Anti-microbial electrosurgical electrode and method of manufacturing same

• US 7,955,637 B2
• Filed: 05/07/2010
• Issued: 06/07/2011
• Est. Priority Date: 12/12/2002
• Status: Active Grant

• Current Assignee: Innovatech, LLC
• Original Assignee: Innovatech, LLC
• Inventors: Nesbitt, Bruce
• Primary Examiner(s): Meeks; Timothy H
• Assistant Examiner(s): Sellman; Cachet I
• Application Number:
  US12/776,039
• Publication Number:
  US 20100215834A1
• Time in Patent Office: 396 Days
• Field of Search: 427 21- 231, 427/180, 427/202, 427/205, 427/458, 427/461, 427/469, 427/470, 427/475, 427/485, 427/486, 606 45- 49
• US Class Current: 427/2.1
• CPC Class Codes: A47J 36/025 Vessels with non-stick features, e.g. coatings
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2018/0013 non-sticking
• CPC Class Codes: A61B 2018/00148 with metal
• CPC Class Codes: A61L 2300/104 Silver, e.g. silver sulfadiazine
• CPC Class Codes: A61L 2300/404 Biocides, antimicrobial agents, antiseptic agents
• CPC Class Codes: A61L 2420/02 Methods for coating medical devices
• CPC Class Codes: A61L 2420/08 Coatings comprising two or more layers
• CPC Class Codes: A61L 31/10 Macromolecular materials
• CPC Class Codes: A61L 31/16 Biologically active materials, e.g. therapeutic substances A61L31/047 takes precedence
• CPC Class Codes: B05D 2601/20 used for non-pigmentation effect
• CPC Class Codes: B05D 3/0281 with induction heating
• CPC Class Codes: B05D 3/20 by magnetic fields
• CPC Class Codes: B05D 5/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
• CPC Class Codes: B05D 5/02 to obtain a matt or rough surface
• CPC Class Codes: B05D 5/06 to obtain multicolour or other optical effects B05D5/02 takes precedence
• CPC Class Codes: B05D 5/08 to obtain an anti-friction or anti-adhesive surface rendering particulate materials free-flowing in general, e.g. making them hydrophobic B01J2/30
• CPC Class Codes: B05D 5/083 involving the use of fluoropolymers
• CPC Class Codes: B05D 7/52 Two layers
• CPC Class Codes: B05D 7/54 : No clear coat specified
• CPC Class Codes: B65G 2249/02 : Controlled or contamination-free environments or clean space conditions
• CPC Class Codes: B65G 49/064 : in a horizontal position B65G49/066 takes precedence
• CPC Class Codes: C03B 35/14 : Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
• CPC Class Codes: F16C 33/201 : Composition of the plastic
• CPC Class Codes: Y10T 428/24372 : Particulate matter
• CPC Class Codes: Y10T 428/2438 : Coated
• CPC Class Codes: Y10T 428/24413 : Metal or metal compound
• CPC Class Codes: Y10T 428/254 : Polymeric or resinous material
• CPC Class Codes: Y10T 428/31725 : Of polyamide
• CPC Class Codes: Y10T 428/32 : Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer

Abstract

An electrosurgical device including a reinforcing underlayment having a non-stick, anti-microbial coating. In one embodiment, the coating includes a non-stick material having anti-microbial particles interspersed in the non-stick material. This coating is applied to the surfaces of the electrode to minimize the build-up of charred tissue on the surfaces of the electrode. Also, the coating tends to kill harmful organisms residing on the surfaces of the electrode. In another embodiment, a primer coating is initially applied to the surfaces of the electrode. A plurality of anti-microbial particles are then applied to the primer coating layer and engage and are embedded in the primer coating layer. A top coat including a non-stick material is applied to the anti-microbial particle layer. In either embodiment, the coating layers applied to the surfaces of the electrode are cured to harden and adhere the layers to the electrode.

Claims

1. A method of coating a medical device including a metal substrate, said method comprising:

(a) applying a wet bonding material to an outer surface of the metal substrate of the medical device;

(b) electrostatically applying a plurality of anti-microbial powder particles to the wet bonding material, said anti-microbial powder particles being formulated to kill a microbial organism independent of any energy source; and

(c) at least partially curing the wet bonding material and the anti-microbial powder particles.

2. The method of claim 1, wherein the substrate is part of a device selected from the group consisting of:

a surgical device and an electrosurgical device.

3. The method of claim 1, wherein at least part of the substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

4. The method of claim 1, wherein the anti-microbial powder particles are selected from the group consisting of:

silver particles, ceramic particles, and a combination of silver and ceramic particles.

5. The method of claim 1, wherein the anti-microbial powder particles include silver particles.

6. The method of claim 5, wherein a first quantity of the anti-microbial powder particles applied to the wet bonding material on a first portion of the outer surface of the metal substrate are more electrically conductive than a second, greater quantity of the anti-microbial powder particles applied to the wet bonding material on a second, different portion of the outer surface of the metal substrate.

7. The method of claim 5, wherein a first density of the anti-microbial powder particles applied to the wet bonding material on a first portion of the outer surface of the metal substrate are more electrically conductive than a second, greater density of the anti-microbial powder particles applied to the wet bonding material on a second, different portion of the outer surface of the metal substrate.

8. The method of claim 1, wherein the wet bonding material includes a non-stick material.

9. The method of claim 8, wherein the non-stick material is selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic, and a combination of fluorosilicones.

10. The method of claim 1, wherein the anti-microbial powder particles include a plurality of different sized anti-microbial powder particles.

11. The method of claim 1, which includes applying a topcoat to the wet bonding material and the anti-microbial powder particles.

12. The method of claim 1, which includes applying a solvent to the anti-microbial powder particles to enhance application of the anti-microbial powder particles to the wet bonding material.

13. The method of claim 1, which includes electrically or electrostatically grounding the wet bonding material and causing said anti-microbial powder particles to have an electrical or electrostatic charge opposite the electrical charge of the wet bonding material.

14. A method of coating a medical device including a metal substrate, said method comprising:

(a) applying a coating to a surface of the metal substrate of the medical device, said coating including a wet bonding material having a plurality of anti-microbial powder particles interspersed in said wet bonding material, said anti-microbial powder particles being at least partially electrostatically bonded to the wet bonding material and being formulated to kill a microbial organism independent of any energy source;

(b) at least partially curing said coating including the wet bonding material and the anti-microbial powder particles interspersed in the wet bonding material;

(c) applying a topcoat to the at least partially cured coating; and

(c) buffing at least a portion of the applied topcoat to expose at least part of said anti-microbial powder particles.

15. The method of claim 14, wherein the substrate is part of a device selected from the group consisting of:

a surgical device and an electrosurgical device.

16. The method of claim 14, wherein at least part of the substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

17. The method of claim 14, which includes curing the buffed bonding material and the anti-microbial powder particles interspersed in the buffed bonding material.

18. The method of claim 14, wherein the anti-microbial powder particles are selected from the group consisting of:

silver particles, ceramic particles, and a combination of silver and ceramic particles.

19. The method of claim 14, wherein the anti-microbial powder particles include silver particles.

20. The method of claim 19, wherein a first quantity of the anti-microbial powder particles interspersed in the wet bonding material applied to a first portion of the surface of the metal substrate are more electrically conductive than a second, greater quantity of the anti-microbial powder particles interspersed in the wet bonding material applied to a second, different portion of the surface of the metal substrate.

21. The method of claim 19, wherein a first density of the anti-microbial powder particles interspersed in the wet bonding material applied to a first portion of the surface of the metal substrate are more electrically conductive than a second, greater density of the anti-microbial powder particles interspersed in the wet bonding material applied to a second, different portion of the surface of the metal substrate.

22. The method of claim 14, wherein the wet bonding material includes a non-stick material.

23. The method of claim 22, wherein the non-stick material is selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic and a combination of fluorosilicones.

24. The method of claim 14, which includes masking a first portion of the surface of the metal substrate of the medical device prior to applying the coating such that no coating or topcoat are applied to the first portion of the surface of the metal substrate of the medical device.

25. A method of coating an electrosurgical electrode including a metal substrate, said method comprising:

(a) selectively applying a coating to a tissue engaging surface of the metal substrate of the electrosurgical electrode such that the coating is applied to a first portion of the tissue engaging surface of the metal substrate of the electrosurgical electrode and no coating is applied to a second portion of the tissue engaging surface of the metal substrate of the electrosurgical electrode, said second portion being adjacent to the first portion, said coating including a wet bonding material having a plurality of anti-microbial powder particles interspersed in said wet bonding material, said anti-microbial powder particles being at least partially electrostatically bonded to the wet bonding material and being formulated to kill a microbial organism independent of any energy source;

(b) at least partially curing said coating applied to the first portion of the tissue engaging surface of the metal substrate of the electrosurgical electrode; and

(c) applying a topcoat to the at least partially cured coating applied to the first portion of the tissue engaging surface of the metal substrate of the electrosurgical electrode.

26. The method of claim 25, wherein at least part of the substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

27. The method of claim 25, wherein the anti-microbial powder particles are selected from the group consisting of:

silver particles, ceramic particles, and a combination of silver and ceramic particles.

28. The method of claim 25, wherein the anti-microbial powder particles include silver particles.

29. The method of claim 28, wherein a first quantity of the anti-microbial powder particles interspersed in the wet bonding material applied to a first area of the first portion of the tissue engaging surface of the metal substrate are more electrically conductive than a second, greater quantity of the anti-microbial powder particles interspersed in the wet bonding material applied to a second, different area of the first portion of the tissue engaging surface of the metal substrate.

30. The method of claim 28, wherein a first density of the anti-microbial powder particles interspersed in the wet bonding material applied to a first area of the first portion of the tissue engaging surface of the metal substrate are more electrically conductive than a second, greater density of the anti-microbial powder particles interspersed in the wet bonding material applied to a second, different area of the portion of the tissue engaging surface of the metal substrate.

31. The method of claim 25, wherein the wet bonding material includes a non-stick material.

32. The method of claim 31, wherein the non-stick material is selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic, and a combination of fluorosilicones.

33. The method of claim 25, which includes masking the second portion of the tissue engaging surface of the metal substrate of the electrosurgical electrode prior to applying the coating to the first portion.

34. A method of coating an electrosurgical electrode including a metal substrate, said method comprising:

(a) applying a coating to a tissue engaging surface of the metal substrate of the electrosurgical electrode, said coating including a wet bonding material having a plurality of anti-microbial powder particles interspersed in said wet bonding material, said anti-microbial powder particles being at least partially electrostatically bonded to the wet bonding material and being formulated to kill a microbial organism independent of any energy source;

(b) at least partially curing said coating applied to a first portion of the surface of the metal substrate of the electrosurgical electrode; and

(c) selectively applying a topcoat to the at least partially cured coating such that the topcoat is applied to the first portion of the applied coating and no topcoat is applied to a second portion of the applied coating.

35. The method of claim 34, wherein at least part of the substrate forms a shape selected from the group consisting of:

a blade, a scalpel, a needle, a probe, a knife, a wire and a ball.

36. The method of claim 34, wherein the anti-microbial powder particles are selected from the group consisting of:

silver particles, ceramic particles, and a combination of silver and ceramic particles.

37. The method of claim 34, wherein the anti-microbial powder particles include silver particles.

38. The method of claim 37, wherein a first quantity of the anti-microbial powder particles interspersed in the wet bonding material applied to a first area of the tissue engaging surface of the metal substrate are more electrically conductive than a second, greater quantity of the anti-microbial powder particles interspersed in the wet bonding material applied to a second, different area of the tissue engaging surface of the metal substrate.

39. The method of claim 37, wherein a first density of the anti-microbial powder particles interspersed in the wet bonding material applied to a first area of the tissue engaging surface of the metal substrate are more electrically conductive than a second, greater density of the anti-microbial powder particles interspersed in the wet bonding material applied to a second, different area of the tissue engaging surface of the metal substrate.

40. The method of claim 34, wherein the wet bonding material includes a non-stick material.

41. The method of claim 40, wherein the non-stick material is selected from the group consisting of:

a silicone, a polytetrafluoroethylene, a fluoropolymer, a ceramic, and a combination of fluorosilicones.

42. The method of claim 34, which includes masking the second portion of the applied coating prior to applying the topcoat to the first portion.