Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
First Claim
1. A method of providing electrostatic discharge protection during a fabrication process of a micro-electronic device, wherein the microelectronic device comprises an array of electronic devices on a substrate, the method comprising:
- applying a plurality of conductive leads to the substrate, wherein the leads connect to the electronic devices;
applying an electrically conductive material to the substrate to serve as a shorting structure;
applying shorting links to the substrate, wherein the shorting links are comprised of an electrically conductive material and are in electrical connection to the conductive leads and the shorting structure; and
wherein the shorting structure is at least partially located in an area of the substrate to attach a microchip and at least one of the group of shorting links or the shorting structure is configured so as to be at least partially removable.
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Accused Products
Abstract
Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.
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Citations
14 Claims
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1. A method of providing electrostatic discharge protection during a fabrication process of a micro-electronic device, wherein the microelectronic device comprises an array of electronic devices on a substrate, the method comprising:
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applying a plurality of conductive leads to the substrate, wherein the leads connect to the electronic devices; applying an electrically conductive material to the substrate to serve as a shorting structure; applying shorting links to the substrate, wherein the shorting links are comprised of an electrically conductive material and are in electrical connection to the conductive leads and the shorting structure; and wherein the shorting structure is at least partially located in an area of the substrate to attach a microchip and at least one of the group of shorting links or the shorting structure is configured so as to be at least partially removable. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of providing electrostatic discharge protection during a fabrication process of a micro-electronic device, wherein the microelectronic device comprises an array of electronic devices on a substrate, the method comprising:
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applying a plurality of conductive leads to the substrate, wherein the leads connect to the electronic devices; and applying shorting links to the substrate in electrical connection with the conductive leads and configuring the shorting links such that all of the conductive leads are connected to a single shorting circuit, wherein the shorting links are comprised of fusible material and are configured so as to be disabled by an electrical current capable of fusing the shorting links. - View Dependent Claims (11, 12, 13, 14)
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Specification