Nanophotovoltaic devices
First Claim
1. A method of forming nanophotovoltaic devices, comprisingproviding a semiconductor-on-insulator wafer having a continuous buried insulating layer separating a thin upper layer from the bulk of the wafer,forming a p-n junction in said upper wafer layer,depositing a first metallic layer on an exposed surface of said thin upper layer so as to form an ohmic contact therewith,removing the bulk portion of the wafer and said continuous insulating layer to generate a structure comprising said upper layer comprising a p-n junction and said metallic layer disposed on a surface thereof,depositing a second metallic layer on an exposed surface of said thin layer opposed to said first metallic layer to form an ohmic contact therewith,applying a photoresist to one of said metallic layers,holographically patterning said resist to generate a two-dimensional holographic recording therein,developing said patterned photoresist to generate a pattern of exposed and unexposed portions, andetching away the exposed portions to generate a plurality of nanophotovoltaic devices.
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Abstract
The present invention provides nanophotovoltaic devices having sizes in a range of about 50 nm to about 5 microns, and method of their fabrication. In some embodiments, the nanophotovoltaic device includes a semiconductor core, e.g., formed of silicon, sandwiched between two metallic layers, one of which forms a Schottky barrier junction with the semiconductor core and the other forms an ohmic contact therewith. In other embodiment, the nanophotovoltaic device includes a semiconductor core comprising a p-n junction that is sandwiched between two metallic layers forming ohmic contacts with the core.
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Citations
8 Claims
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1. A method of forming nanophotovoltaic devices, comprising
providing a semiconductor-on-insulator wafer having a continuous buried insulating layer separating a thin upper layer from the bulk of the wafer, forming a p-n junction in said upper wafer layer, depositing a first metallic layer on an exposed surface of said thin upper layer so as to form an ohmic contact therewith, removing the bulk portion of the wafer and said continuous insulating layer to generate a structure comprising said upper layer comprising a p-n junction and said metallic layer disposed on a surface thereof, depositing a second metallic layer on an exposed surface of said thin layer opposed to said first metallic layer to form an ohmic contact therewith, applying a photoresist to one of said metallic layers, holographically patterning said resist to generate a two-dimensional holographic recording therein, developing said patterned photoresist to generate a pattern of exposed and unexposed portions, and etching away the exposed portions to generate a plurality of nanophotovoltaic devices.
Specification