Semiconductor package with patterning layer and method of making same
First Claim
1. A semiconductor package, comprising:
- a substrate including an insulative layer defining opposed first and second surfaces and having a first conductive pattern disposed on the first surface and a second conductive pattern disposed on the second surface and electrically connected to the first conductive pattern;
at least one semiconductor die mounted to the insulative layer and electrically connected to the first conductive pattern thereof;
a patterning layer defining a first surface, the patterning layer at least partially encapsulating the semiconductor die and at least partially covering the first conductive pattern and the first surface of the insulative layer, the second conductive pattern not being covered by the patterning layer; and
a wiring pattern embedded in the patterning layer and electrically connecting the semiconductor die to the first conductive pattern of the substrate, a portion of the wiring pattern being exposed in and substantially flush with the first surface of the patterning layer.
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Accused Products
Abstract
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including one or more semiconductor dies which are electrically connected to an underlying substrate through the use of a conductive pattern which is at least partially embedded in a patterning layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate is at least one semiconductor die. The semiconductor die and the substrate are at least partially encapsulated by a patterning layer. Embedded in the patterning layer is a wiring pattern which electrically connects the semiconductor die to the conductive pattern. A portion of the wiring pattern is exposed in the patterning layer.
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Citations
19 Claims
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1. A semiconductor package, comprising:
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a substrate including an insulative layer defining opposed first and second surfaces and having a first conductive pattern disposed on the first surface and a second conductive pattern disposed on the second surface and electrically connected to the first conductive pattern; at least one semiconductor die mounted to the insulative layer and electrically connected to the first conductive pattern thereof; a patterning layer defining a first surface, the patterning layer at least partially encapsulating the semiconductor die and at least partially covering the first conductive pattern and the first surface of the insulative layer, the second conductive pattern not being covered by the patterning layer; and a wiring pattern embedded in the patterning layer and electrically connecting the semiconductor die to the first conductive pattern of the substrate, a portion of the wiring pattern being exposed in and substantially flush with the first surface of the patterning layer. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor package, comprising:
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a substrate including an insulative layer defining opposed first and second surfaces and having a conductive pattern disposed on each of the first and second surfaces, the conductive patterns being electrically connected to each other in a prescribed manner; a first patterning layer defining a first surface, the first patterning layer at least partially covering the first surface of the insulative layer and the conductive pattern disposed thereon, the conductive pattern disposed on the second surface of the insulative layer not being covered by the first patterning layer; a first wiring pattern embedded in the first patterning layer and electrically connected to the conductive pattern disposed on the first surface of the insulating layer, a portion of the first wiring pattern being exposed in and substantially flush with the first surface of the first patterning layer; and a first semiconductor die electrically connected to the first wiring pattern. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification