Implantable microstimulator with external electrodes disposed on a film substrate and methods of manufacture and use
First Claim
Patent Images
1. An implantable microstimulator, comprising:
- a housing defining an interior and an exterior;
an electronic subassembly disposed in the interior of, and surrounded by, the housing;
a plurality of conductive vias electrically coupled to the subassembly and extending from the interior to the exterior of the housing;
an electrode arrangement disposed on the housing and comprisinga flexible, non-conductive, polymer film substrate external to the housing and disposed over a portion of the exterior of the housing and forming a portion of an exterior surface of the microstimulator, anda plurality of thin electrodes disposed entirely on the film substrate and exposed on an exterior of the implantable microstimulator, wherein the plurality of electrodes are separated from the housing by the film substrate and the plurality of electrodes are coupled to the electronic subassembly through the plurality of conductive vias and are configured and arranged to stimulate adjacent tissue when implanted; and
a plurality of conductors disposed on the film substrate and electrically coupling the plurality of electrodes to the plurality of conductive vias.
2 Assignments
0 Petitions
Accused Products
Abstract
An implantable microstimulator includes a housing, an electronic subassembly, conductive vias, and an electrode arrangement. The housing defines an interior and an exterior with the electronic subassembly disposed in the interior of the housing. The conductive vias extend from the interior to the exterior of the housing. The electrode arrangement is disposed on the housing and includes a film substrate with electrodes disposed on the film substrate and coupled to the electronic subassembly through the plurality of vias.
44 Citations
20 Claims
-
1. An implantable microstimulator, comprising:
-
a housing defining an interior and an exterior; an electronic subassembly disposed in the interior of, and surrounded by, the housing; a plurality of conductive vias electrically coupled to the subassembly and extending from the interior to the exterior of the housing; an electrode arrangement disposed on the housing and comprising a flexible, non-conductive, polymer film substrate external to the housing and disposed over a portion of the exterior of the housing and forming a portion of an exterior surface of the microstimulator, and a plurality of thin electrodes disposed entirely on the film substrate and exposed on an exterior of the implantable microstimulator, wherein the plurality of electrodes are separated from the housing by the film substrate and the plurality of electrodes are coupled to the electronic subassembly through the plurality of conductive vias and are configured and arranged to stimulate adjacent tissue when implanted; and a plurality of conductors disposed on the film substrate and electrically coupling the plurality of electrodes to the plurality of conductive vias. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. An implantable device, comprising:
-
a housing defining an interior and an exterior; an electronic subassembly disposed in the interior of, and surrounded by, the housing; a plurality of conductive vias electrically coupled to the subassembly and extending from the interior to the exterior of the housing; a flexible, polymer film substrate external to the housing and forming a portion of the exterior of the implantable device and having a plurality of electrodes and a plurality of contact pads entirely disposed thereon, wherein the plurality of contact pads are in electrical contact with the plurality of conductive vias and the plurality of electrodes and wherein the plurality of electrodes are separated from the housing by the film substrate; a plurality of conductors disposed on the film substrate and electrically coupling the plurality of electrodes to the plurality of conductive vias; and a support member coupled to the housing and disposed over the substrate and the vias, the support member applying pressure to the substrate to maintain the electrical contact between the vias and the contact pads, wherein the plurality of electrodes are exposed on an exterior of the implantable microstimulator and are configured and arranged to stimulate adjacent tissue when implanted. - View Dependent Claims (11, 12, 13, 14, 15)
-
-
16. A method of making an implantable microstimulator, the method comprising:
-
placing an electronic subassembly into, and surrounded by, a non-conductive housing; forming a plurality of conductive vias through the housing; forming a plurality of electrodes, conductors, and contact pads on a flexible, polymer film substrate, the conductors coupling the electrodes to the contact pads, wherein the plurality of electrodes are separated from the housing by the film substrate; disposing the film substrate, which is external to the housing, over a portion of an exterior of the housing with the contact pads in electrical communication with the conductive vias, wherein the film substrate forms a portion of an exterior surface of the implantable microstimulator; and coupling the electronic subassembly to the conductive vias, wherein the plurality of electrodes are exposed on an exterior of the implantable microstimulator and are configured and arranged to stimulate adjacent tissue when implanted. - View Dependent Claims (17, 18, 19, 20)
-
Specification