Counter-stream-mode oscillating-flow heat transport apparatus

• US 7,958,934 B2
• Filed: 09/08/2008
• Issued: 06/14/2011
• Est. Priority Date: 08/07/2002
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Nara, Kenichi, Kohara, Kimio, Inoue, Seiji, Hagiwara, Yasumasa, Yatsuzuka, Shinichi
• Primary Examiner(s): Duong; Tho v
• Application Number:
  US12/231,980
• Publication Number:
  US 20090014162A1
• Time in Patent Office: 1,009 Days
• Field of Search: 165/148, 165/80.4, 165/104.22, 165/104.28, 165/104.21, 361/699, 361/700, 257/714, 257/715
• US Class Current: 165/80.4
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 13/10 by imparting a pulsating motion to the flow, e.g. by sonic vibration
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Abstract

A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.

Claims

1. A heat transport apparatus comprising:

a heat source having a generally planar plate surface;

a heat transport member defining therein a continuously provided heat-transport passage in which a fluid is sealed, the heat transport member having a heat exchange portion configured to absorb heat from the heat source; and

an oscillating member configured to oscillate the fluid in the heat-transport passage, wherein;

the heat exchange portion has a contact surface that contacts the planar plate surface of the heat source

the heat transport member has approximately an L shape in cross-section, which includes a perpendicular portion extending from the contact surface to be generally perpendicular to the planar plate surface, a parallel portion extending generally parallel with the planar plate surface, and a bent portion bent from the perpendicular portion to the parallel portion; and

the heat-transport passage is U-turned at the heat exchange portion to have adjacent passage portions directly communicating with the heat exchange portion, and the adjacent passage portions are configured in contact with each other to perform a heat exchange therebetween;

the heat transfer member includes a plurality of the heat transport members having L-shapes in cross section that have different dimensions in the perpendicular portions and the parallel portions and are stacked with each other in the L-shapes to define plural heat-transport passages,

the heat exchange portion of each of the heat transport members is configured to contact the planar plate surface at the contact surface; and

the passage portions of adjacent heat-transport passages are in contact with each other.

2. The heat transport apparatus according to claim 1, wherein:

the continuously provided heat-transport passage is U-turned to form a plurality of the heat exchange portions that are arranged in an arrangement direction parallel to the planar plate surface;

the adjacent passage portions are provided for each heat exchange portion; and

the passage portions of adjacent heat exchange portions are in contact with each other to perform a heat exchange therebetween.

4. The heat transport apparatus according to claim 1, wherein each of the heat-transport passages has approximately an L shape.

5. An assembly comprising a pair of the heat transport apparatus according to claim 1, wherein the pair of the heat transport apparatus are line-symmetrical to each other.

3. A heat transport apparatus comprising:

a heat source having a generally planar plate surface;

a heat transport member defining therein a continuously provided heat-transport passage in which a fluid is sealed, the heat transport member having a heat exchange portion configured to absorb heat from the heat source; and

an oscillating member configured to oscillate the fluid in the heat-transport passage, wherein;

the heat exchange portion has a contact surface that contacts the planar plate surface of the heat source;

the heat transport member has approximately an L shape in cross-section, which includes a perpendicular portion extending from the contact surface to be generally perpendicular to the planar plate surface, a parallel portion extending generally parallel with the planar plate surface, and a bent portion bent from the perpendicular portion to the parallel portion;

the heat-transport passage is U-turned at the heat exchange portion to have adjacent passage portions directly communicating with the heat exchange portion, and the adjacent passage portions are configured in contact with each other to perform a heat exchange therebetween;

the heat transport member includes a plurality of the heat transport members having L-shapes in cross section that have different dimensions in the perpendicular portions and the parallel portions and are stacked with each other in the L-shapes to define plural heat-transport passages;

each of the heat transport members is configured to contact the planar plate surface at the contact surface;

the passage portions of adjacent heat-transport passages are configured in contact with each other;

the heat-transport passage in each heat transport member is U-turned at plural times to form a plurality of the heat exchange portions that are arranged in an arrangement direction parallel to the planar plate surface;

the adjacent passage portions are provided for each heat exchange portion in each heat-transport passage; and

the passage portions of adjacent two of the heat exchange portions are configured in contact with each other.