Low-profile thermosyphon-based cooling system for computers and other electronic devices
First Claim
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1. A thermosyphon cooling device comprising:
- (a) an evaporator having a length between about 0.75 inches and about 3.5 inches, a width between about 0.75 inches and about 3.5 inches, and a height between about 0.5 inches and about 1.7 inches;
(b) a narrow condenser having a length between about 5.0 inches and about 15.0 inches, a width between about 0.2 inches and about 0.5 inches, and a height between about 1.0 inches and about 1.7 inches;
(c) a liquid coolant within said evaporator and condenser;
(d) at least one coolant pipe connecting said evaporator to said condenser, wherein said at least one coolant pipe is at or below the level of said liquid coolant; and
(e) at least one vapor pipe connecting said evaporator with said condenser, wherein said at least one vapor pipe is above the level of said liquid coolant.
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Abstract
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.
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Citations
20 Claims
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1. A thermosyphon cooling device comprising:
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(a) an evaporator having a length between about 0.75 inches and about 3.5 inches, a width between about 0.75 inches and about 3.5 inches, and a height between about 0.5 inches and about 1.7 inches; (b) a narrow condenser having a length between about 5.0 inches and about 15.0 inches, a width between about 0.2 inches and about 0.5 inches, and a height between about 1.0 inches and about 1.7 inches; (c) a liquid coolant within said evaporator and condenser; (d) at least one coolant pipe connecting said evaporator to said condenser, wherein said at least one coolant pipe is at or below the level of said liquid coolant; and (e) at least one vapor pipe connecting said evaporator with said condenser, wherein said at least one vapor pipe is above the level of said liquid coolant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A computer system comprising:
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(a) a computer case, wherein said case has a width of about 17 inches or less, a height of 1.75 inches or less, and length of 28 inches or less; (b) at least one heat source within said computer case; and (c) at least one thermosyphon device within said computer case, said thermosyphon device comprising; (i) an evaporator having a length between about 0.75 inches and about 3.5 inches, a width between about 0.75 inches and about 3.5 inches, and a height between about 0.5 inches and about 1.7 inches; (ii) a narrow condenser having a length between about 5.0 inches and about 15.0 inches, a width between about 0.2 inches and about 0.5 inches, and a height between about 1.0 inches and about 1.7 inches; (iii) a liquid coolant within said evaporator and condenser; (iv) at least one coolant pipe connecting said evaporator to said condenser, wherein said at least one coolant pipe is at or below the level of said liquid coolant; and (v) at least one vapor pipe connecting said evaporator with said condenser, wherein said at least one vapor pipe is above the level of said liquid coolant. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification