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Electronic inlay module used for electronic cards and tags

  • US 7,959,085 B2
  • Filed: 04/09/2007
  • Issued: 06/14/2011
  • Est. Priority Date: 04/10/2006
  • Status: Active Grant
First Claim
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1. An electronic inlay, comprising:

  • a circuit board, having a top surface and a bottom surface;

    a plurality of circuit components attached to the top surface of the circuit board;

    a bottom cover sheet directly and uniformly attached to the bottom surface of the circuit board over their entire common surfaces;

    a top cover sheet positioned above the top surface of the circuit board; and

    a layer of injected thermosetting material between the bottom cover sheet and the top cover sheet.

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