Method of manufacturing a system in package
First Claim
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1. A method of manufacturing a system in package, comprising:
- providing a substrate;
testing the substrate;
after testing the substrate, mounting a test controller on the substrate;
storing self test signals in an on-board memory inside the test controller;
testing the test controller, wherein testing the test controller comprises testing the test controller using a built-in self test engine within the test controller and the self test signals that are stored in the on-board memory inside the test controller;
if the test controller passes the test, mounting a first die on the substrate, the first die being conductively coupled to the test controller;
testing the first die by providing the test controller with a plurality of test signals and communicating at least a subset of the test signals between the test controller and the first die;
after testing the first die to establish that mounting the first die on the substrate has been successfully completed, mounting a second die on the substrate, the second die being conductively coupled to the test controllers; and
testing the second die by providing the test controller with a first further plurality of test signals and communicating at least a subset of the first further plurality of test signals between the test controller and the second die.
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Abstract
A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has been mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die (30) is mounted onto the substrate (15). This way, the system in package (10) can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies (30) function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package (10) is obtained that has an improved yield compared to known manufacturing methods.
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Citations
14 Claims
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1. A method of manufacturing a system in package, comprising:
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providing a substrate; testing the substrate; after testing the substrate, mounting a test controller on the substrate; storing self test signals in an on-board memory inside the test controller; testing the test controller, wherein testing the test controller comprises testing the test controller using a built-in self test engine within the test controller and the self test signals that are stored in the on-board memory inside the test controller; if the test controller passes the test, mounting a first die on the substrate, the first die being conductively coupled to the test controller; testing the first die by providing the test controller with a plurality of test signals and communicating at least a subset of the test signals between the test controller and the first die; after testing the first die to establish that mounting the first die on the substrate has been successfully completed, mounting a second die on the substrate, the second die being conductively coupled to the test controllers; and testing the second die by providing the test controller with a first further plurality of test signals and communicating at least a subset of the first further plurality of test signals between the test controller and the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification