Method for the manufacture of electronic devices on substrates and devices related thereto
First Claim
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1. A method for the manufacture of an electronic device comprising:
- releasably bonding a first surface of a device substrate to a surface of a first carrier substrate using a first bonding agent to produce a first composite substrate;
while the device substrate is bonded to the first carrier substrate, processing the device substrate to manufacture an electronic device at a second surface of the device substrate; and
releasing the device substrate from the first carrier substrate using a releasing agent, wherein the surface of the first carrier substrate comprises a pattern of trenches formed in the first surface of the first carrier substrate, and wherein the first carrier substrate is free of any through holes.
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Abstract
Methods for manufacturing electronic devices and devices produced by those methods are disclosed. One such method includes releasably bonding a first surface of a device substrate to a face of a first carrier substrate using a first bonding agent to produce a first composite substrate, where the face of the first carrier substrate includes a pattern of trenches. The method also includes processing the device substrate to manufacture an electronic device on a second surface of the device substrate. The method further includes releasing the device substrate from the first carrier substrate by a releasing agent.
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Citations
15 Claims
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1. A method for the manufacture of an electronic device comprising:
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releasably bonding a first surface of a device substrate to a surface of a first carrier substrate using a first bonding agent to produce a first composite substrate; while the device substrate is bonded to the first carrier substrate, processing the device substrate to manufacture an electronic device at a second surface of the device substrate; and releasing the device substrate from the first carrier substrate using a releasing agent, wherein the surface of the first carrier substrate comprises a pattern of trenches formed in the first surface of the first carrier substrate, and wherein the first carrier substrate is free of any through holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification