Conformal shield on punch QFN semiconductor package
First Claim
1. A semiconductor package comprising:
- a semiconductor die;
a plurality of leads extending at least partially about the semiconductor die which is electrically connected to at least some of the leads;
a package body covering at least portions of the semiconductor die and the leads, the package body having a top surface, a bottom surface, a shoulder which is disposed in opposed relation to the bottom surface and recessed relative to the top surface, a first side surface which extends between the top surface and the shoulder, and a second side surface which extends between the shoulder and the bottom surface, the package body being formed such that one or more, but not all, of the leads include a portion which is exposed in the shoulder, and each of the leads includes a portion which is exposed in the bottom surface; and
a conformal shield which is disposed on at least a portion of the package body and is electrically connected to any portions of the leads which are exposed in the shoulder.
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Accused Products
Abstract
In accordance with the present invention, there is provided a punch quad flat no leads (QFN) semiconductor package including a leadframe wherein the leads of the leadframe are selectively half-etched so that only one or more prescribed leads may be electrically connected to a conformal shield applied to the package body of the semiconductor package. The conformal shield may be electrically connected to the exposed lead(s) alone, or in combination with one or more tie bars of the leadframe. In one embodiment, outer end portions of the top surfaces of the leads of the semiconductor package are alternately exposed and non-exposed, with the non-exposed leads including a top side half-etch which causes the same to be effectively covered by the package body of the semiconductor package.
401 Citations
20 Claims
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1. A semiconductor package comprising:
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a semiconductor die; a plurality of leads extending at least partially about the semiconductor die which is electrically connected to at least some of the leads; a package body covering at least portions of the semiconductor die and the leads, the package body having a top surface, a bottom surface, a shoulder which is disposed in opposed relation to the bottom surface and recessed relative to the top surface, a first side surface which extends between the top surface and the shoulder, and a second side surface which extends between the shoulder and the bottom surface, the package body being formed such that one or more, but not all, of the leads include a portion which is exposed in the shoulder, and each of the leads includes a portion which is exposed in the bottom surface; and a conformal shield which is disposed on at least a portion of the package body and is electrically connected to any portions of the leads which are exposed in the shoulder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor package comprising:
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a die pad; a semiconductor die attached to the die pad; a plurality of leads extending at least partially about the die pad in spaced relation thereto, the semiconductor die being electrically connected to at least some of the leads; a package body covering at least portions of the semiconductor die, the die pad and the leads, the package body having a top surface, a bottom surface, a shoulder which is disposed in opposed relation to the bottom surface and recessed relative to the top surface, a first side surface which extends between the top surface and the shoulder, and a second side surface which extends between the shoulder and the bottom surface, the package body being formed such that one or more, but not all, of the leads include a portion which is exposed in the shoulder, a portion of the die pad is exposed in the bottom surface, and each of the leads includes a portion which is exposed in the bottom surface; and a conformal shield which is disposed on at least a portion of the package body and is electrically connected to any portions of the leads which are exposed in the shoulder. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A semiconductor package comprising:
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a die pad; a semiconductor die attached to the die pad; a plurality of leads extending at least partially about the die pad in spaced relation thereto, the semiconductor die being electrically connected to at least some of the leads; a plurality of tie bars attached to the die pad and extending therefrom; a package body covering at least portions of the semiconductor die, the die pad, the tie bars and the leads, the package body having a top surface, a bottom surface, and a shoulder which is oriented between the top and bottom surfaces, the package body being formed such that at least one of the tie bars includes a portion which is exposed in the shoulder, one or more, but not all, of the leads include a portion which is exposed in the shoulder, and each of the leads includes a portion which is exposed in the bottom surface; and a conformal shield which is disposed on at least a portion of the package body and is electrically connected to any portion of any one of the tie bars and the leads which is exposed in the shoulder.
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Specification