Methods and apparatus for multi-modal wafer testing
First Claim
1. An assembly for providing concurrent electrical access to one or more integrated circuits on a wafer, comprising:
- an edge-extended wafer translator having a central portion, and an edge-extended portion vertically offset from the central portion;
a mounting fixture upon which the vertically offset edge-extended portion is disposed;
a first probe structure operable to contact a first plurality of inquiry-side contact terminals; and
a second probe structure operable to contact a second plurality of inquiry-side contact terminals;
wherein removably attaching the wafer to the central portion brings a first plurality of wafer-side contact terminals into electrical contact with a first set of pads on the wafer, and brings a second plurality of wafer-side contact terminals into electrical contact with a second set of pads on the wafer;
wherein the first plurality of wafer-side contact terminals are electrically connected to the first plurality of inquiry-side contact terminals disposed on the central portion of the edge-extended wafer translator, and the second plurality of wafer-side contacts are electrically connected to the second plurality of inquiry-side contact terminals disposed on the edge-extended portion of edge-extended wafer translator; and
wherein, during operation, the first probe structure is laterally movable relative to the mounting fixture and the second probe structure is fixed relative to the mounting fixture.
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Accused Products
Abstract
Access to integrated circuits of a wafer for concurrently performing two or more types of testing, is provided by bringing a wafer and an edge-extended wafer translator into an attached state. The edge-extended wafer translator having wafer-side contact terminals and inquiry-side contact terminals disposed thereon, a first set of wafer-side contact terminals being electrically coupled to a first set of inquiry-side contact terminals, and a second set of wafer-side contact terminals being electrically coupled to a second set of inquiry-side contact terminals. The edge-extended wafer translator having a central portion generally coextensive with the attached wafer, and an edge-extended portion extending beyond the boundary generally defined by the outer circumferential edge of the wafer. A first set of pads of at least one integrated circuit is electrically coupled to the first set of wafer-side contact terminals, and a second set of pads of the integrated circuit is electrically coupled to the second set of wafer-side contact terminals. The edge-extended wafer translator may be shaped such that its edge-extended portion is not coplanar with the central portion thereof.
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Citations
14 Claims
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1. An assembly for providing concurrent electrical access to one or more integrated circuits on a wafer, comprising:
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an edge-extended wafer translator having a central portion, and an edge-extended portion vertically offset from the central portion; a mounting fixture upon which the vertically offset edge-extended portion is disposed; a first probe structure operable to contact a first plurality of inquiry-side contact terminals; and a second probe structure operable to contact a second plurality of inquiry-side contact terminals; wherein removably attaching the wafer to the central portion brings a first plurality of wafer-side contact terminals into electrical contact with a first set of pads on the wafer, and brings a second plurality of wafer-side contact terminals into electrical contact with a second set of pads on the wafer;
wherein the first plurality of wafer-side contact terminals are electrically connected to the first plurality of inquiry-side contact terminals disposed on the central portion of the edge-extended wafer translator, and the second plurality of wafer-side contacts are electrically connected to the second plurality of inquiry-side contact terminals disposed on the edge-extended portion of edge-extended wafer translator; and
wherein, during operation, the first probe structure is laterally movable relative to the mounting fixture and the second probe structure is fixed relative to the mounting fixture. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An assembly for providing concurrent electrical access to one or more integrated circuits on a wafer, comprising:
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an edge-extended wafer translator having a central portion, an edge-extended portion vertically offset from the central portion, and the edge-extended wafer translator further having a wafer-side and an inquiry-side; a mounting fixture having an upper surface and a lower surface, the wafer-side of the vertically offset edge-extended portion of the edge-extended wafer translator disposed upon the upper surface of the mounting fixture; a first probe structure operable to contact a first plurality of inquiry-side contact terminals; and a second probe structure operable to contact a second plurality of inquiry-side contact terminals; wherein removably attaching the wafer to the central portion brings a first plurality of wafer-side contact terminals into electrical contact with a first set of pads on the wafer, and brings a second plurality of wafer-side contact terminals into electrical contact with a second set of pads on the wafer;
wherein the first plurality of wafer-side contact terminals are electrically connected to the first plurality of inquiry-side contact terminals disposed on the central portion of the edge-extended wafer translator, and the second plurality of wafer-side contacts are electrically connected to the second plurality of inquiry-side contact terminals disposed on the edge-extended portion of edge-extended wafer translator; and
wherein, the first probe structure is laterally movable relative to the mounting fixture. - View Dependent Claims (12, 13, 14)
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Specification