Electric circuit device, electric circuit module, and power converter

• US 7,961,472 B2
• Filed: 04/26/2007
• Issued: 06/14/2011
• Est. Priority Date: 04/27/2006
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: Tokuyama, Takeshi, Kawabata, Atsushi, Nakatsu, Kinya
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): Thomas; Bradley H
• Application Number:
  US11/740,622
• Publication Number:
  US 20070252169A1
• Time in Patent Office: 1,510 Days
• Field of Search: 361/717
• US Class Current: 361/718
• CPC Class Codes: H01G 2/08 Cooling arrangements; Heating arrangements; Ventilating arrangements
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/02 : Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: Y02T 10/70 : Energy storage systems for electromobility, e.g. batteries

Abstract

The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.

The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Claims

1. An electric circuit device comprising:

a plurality of semiconductor chips;

a plurality of plate-shaped conductors electrically connected to said plurality of semiconductor chips; and

a plus side terminal and a minus side terminal for transmitting direct current;

wherein said plurality of semiconductor chips includes a first insulated gate bipolar transistor and a first diode constituting an upper arm portion of an inverter circuit, and a second insulated gate bipolar transistor and a second diode constituting a lower arm portion of the inverter circuit;

said plurality of plate-shaped conductors includes an intermediate plate-shaped conductor that connects said upper arm portion of the inverter circuit and said lower arm portion of said inverter circuit, a plate-shaped conductor for direct-current positive polarity, and a plate-shaped conductor for direct-current negative polarity;

said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity are arranged to provide a first region in which said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity are laminated, a second region in which only said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity are opposed, and a third region in which only said intermediate plate-shaped conductor and said plate-shaped conductor for direct current negative polarity are opposed;

said first insulated gate bipolar transistor and said first diode are arranged in the second region that is inserted between said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity;

said second insulated gate bipolar transistor and said second diode are arranged in the third region that is inserted between said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity;

said plate-shaped conductor for direct-current positive polarity is connected with a part that forms said first region of said plate-shaped conductor for direct-current positive polarity; and

said plate-shaped conductor for direct-current negative polarity is connected with a part that forms said first region of said plate-shaped conductor for direct-current negative polarity.

2. The electric circuit device according to claim 1, wherein:

each of said plurality of plate-shaped conductors has a heat release plane for the heat, said heat release plane being formed on the conductor plane opposite to the side on which said semiconductor chips are sandwiched.

3. The electric circuit device according to claim 1, further comprising a packaging structure;

wherein at least portions of said plurality of semiconductor chips and portions of said plurality of plate-shaped conductors are embedded in said packaging structure;

a heat release plane for heat is formed on conductor planes of said plural plate-shaped conductors, which exist on the side opposite to said semiconductor chip side; and

said heat release plane is exposed at the surface of said packaging structure.

4. The electric circuit device according to claim 3, wherein:

said packaging structure includes one pair of planes, one of which is an upper plane and the other is a lower plane; and

said heat release planes of said plate-shaped conductor for direct-current positive polarity and said plate-shaped conductor for direct-current negative polarity are exposed at a surface of one plane of the pair of planes, and said heat release plane of said intermediate plate-shaped conductor is exposed at a surface of the other plane of the pair of planes.

5. The electric circuit device according to claim 1, wherein:

said plurality of semiconductor chips each includes a metallic buffering structure on one chip surface, each semiconductor chip being mounted on a conductor plane of said associated plate-shaped conductor via said buffering structure.

6. The electric circuit device according to claim 5, wherein:

the chip surface on which said buffering structure is provided is the same as a chip surface on which an electrode for a control signal is provided.

7. The electric circuit device according to claim 5, wherein:

said buffering structure is formed integrally with said plate-shaped conductor.

8. The electric circuit device according to claim 1, wherein:

said plate-shaped conductor for direct-current positive polarity and said plate-shaped conductor for direct-current negative polarity are each arranged at one conductor plane of said intermediate plate-shaped conductor such that one conductor plane of each of said plate-shaped conductor for direct-current positive polarity and said plate-shaped conductor for direct-current negative polarity faces one conductor plane of said intermediate plate-shaped conductor; and

said plate-shaped conductor for direct-current positive polarity and said plate-shaped conductor for direct-current negative polarity each extend along one conductor plane of said intermediate plate-shaped conductor so that one conductor plane of said plate-shaped conductor for direct-current positive polarity and one conductor plane of said plate-shaped conductor for direct-current negative polarity each face one conductor plane of said intermediate plate-shaped conductor.

9. The electric circuit device according to claim 1, wherein:

said plus side terminal and said minus side terminal, and said plate-shaped terminal formed on said intermediate plate-shaped conductor extend in directions opposite to each other.

10. The electric circuit device according to claim 9, wherein:

said plus side terminal formed at said plate-shaped conductor for direct-current positive polarity and said minus side terminal formed at said plate-shaped conductor for direct-current negative polarity have respective terminal surfaces opposed to each other.

11. The electric circuit device according to claim 10, wherein:

said plus side terminal and said minus side terminal are formed such that an opposing distance between respective terminal surfaces is greater than an opposing distance between respective conductor planes.

12. The electric circuit device according to claim 10, wherein:

said plus side terminal and said minus side terminal have two screw holes; and

said two screw holes are provided at positions shifted from each other.

13. An electric circuit module comprising:

a heat release element with a surface which is cooled by a cooling medium;

an electric circuit device mounted in said heat release element, said electric circuit device having a plurality of semiconductor chips, a plurality of plate-shaped conductors each electrically connected to any one of said plural semiconductor chips, a plus-side terminal, and a minus-side terminal; and

an insulating element disposed between said electric circuit device and said heat release element;

wherein;

said plurality of semiconductor chips includes a first insulated gate bipolar transistor and a first diode constituting an upper arm portion of an inverter circuit, and a second insulated gate bipolar transistor and a second diode constituting a lower arm portion of the inverter circuit;

said plurality of plate-shaped conductors includes an intermediate plate-shaped conductor that connects said upper arm circuit portion and said lower arm circuit portion, a plate-shaped conductor for direct-current positive polarity, and a plate-shaped conductor for direct-current negative polarity;

said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity are arranged for providing a first region in which said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity are laminated, a second region in which only said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity are opposed, and a third region in which only said intermediate plate-shaped conductor for direct-current negative polarity are opposed;

said first insulated gate bipolar transistor and said first diode are arranged in the second region that is inserted between said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity;

said second insulated gate bipolar transistor and said second diode are arranged in the third region that is inserted between said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current negative polarity;

said plate-shaped conductor for direct-current positive polarity is connected with a part that forms said first region of said plate-shaped conductor for direct-current positive polarity;

said plate-shaped conductor for direct-current negative polarity is connected with a part that forms said first region of said plate-shaped conductor for direct-current negative polarity;

a heat release plane is included in said conductor plane of said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate shaped conductor for direct-current negative polarity that is formed at a side opposite to said associated semiconductor chip;

said heat release plane abuts one insulating plane of said insulating element; and

another insulating plane of said insulating element abuts said heat release element surface that is cooled.

14. The electric circuit module according to claim 13, wherein:

said heat release element includes a plurality of flow channels through which said cooling medium flows;

said plurality of flow channels are arranged next to one another with said electric circuit device sandwiched therebetween; and

the surface that is cooled is formed between each of said flow channels and said insulating element.

15. The electric circuit module according to claim 14, further comprising:

a plurality of said electric circuit devices, wherein

said plurality of said electric circuit devices are arranged next to one another along said plurality of flow channels such that said heat release plane is oriented towards the surface cooled.

16. An electric power converter comprising:

an electric circuit module which constitutes an electric power conversion circuit;

a controller which controls operation of said electric circuit module; and

a capacitor device electrically connected to said power conversion circuit;

wherein said electric circuit module includes;

a heat release element with a surface which is cooled by a cooling medium;

an electric circuit device mounted in said heat release element, said electric circuit device having a plurality of semiconductor chips and a plurality of plate-shaped conductors each electrically connected to any one of said plural semiconductor chips, a plus-side terminal, and a minus-side terminal; and

an insulating element disposed between said electric circuit device and said heat release element; and

wherein;

said plurality of semiconductor chips includes a first insulated gate bipolar transistor and a first diode constituting an upper arm portion of an inverter circuit, and a second insulated gate bipolar transistor and a second diode constituting a lower arm portion of the inverter circuit;

said plurality of plate-shaped conductors includes an intermediate plate-shaped conductor that connects said upper arm circuit portion and said lower arm circuit portion, a plate-shaped conductor for direct-current positive polarity, and a plate-shaped conductor for direct-current negative polarity;

said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity are arranged for providing a first region in which said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity are laminated a second region in which only said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity are opposed, and a third region in which only said intermediate plate-shaped conductor for direct-current negative polarity are opposed;

said first insulated gate bipolar transistor and said first diode are arranged in the second region that is inserted between said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current positive polarity;

said second insulated gate bipolar transistor and said second diode are arranged in the third region that is inserted between said intermediate plate-shaped conductor and said plate-shaped conductor for direct-current negative polarity;

said plate-shaped conductor for direct-current positive polarity is connected with a part that forms said first region of said plate-shaped conductor for direct-current positive polarity;

said plate-shaped conductor for direct-current negative polarity is connected with a part that forms said first region of said plate-shaped conductor for direct-current negative polarity;

a heat release plane is included in said conductor plane of said intermediate plate-shaped conductor, said plate-shaped conductor for direct-current positive polarity, and said plate-shaped conductor for direct-current negative polarity that is formed at a side opposite to said associated semiconductor chip;

said heat release plane abuts one insulating plane of said insulating element;

said other insulating plane of said insulating element abuts said heat release element surface that is cooled; and

said capacitor device is electrically connected to said plate-shaped conductor for direct-current positive polarity and to said plate-shaped conductor for direct-current negative polarity.

17. The electric power converter according to claim 16, wherein:

said capacitor device includes one pair of plate-shaped capacitor terminals disposed such that terminal surfaces thereof are opposed to each other; and

in order to ensure that the terminals of the same polarity face and abut each other, a plus-side terminal, a minus-side terminal, said plate-shaped conductor terminal pair, and said plate-shaped capacitor terminal pair are each connected such that one terminal of the terminal pair is sandwiched from both sides of the other terminal.

18. The electric power converter according to claim 17, wherein:

a protrusion on one terminal of said plate-shaped capacitor terminal pair and a protrusion on the other terminal of said plate-shaped capacitor terminal pair are provided at the same position on the terminal surface, and protrude in opposite directions.